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DONNER COMPANY Case Analysis
Group AG1 Aryan Jain Hamza Umar Nikita Jain Parth Shah Preetinisha
(13610) (13627) (13632) (13635) (13637)
INTRODUCTION
Donner Company was started in 1985. Since the start of operations, it had specialized in making circuit boards for experimental devices and for pilot production runs. Edward Plummer was the President and Bruce Altmeyer was the firm's Design Engineer. The manufacturing process involved production of circuit boards known in the trade as "soldermask over bare copper"(SMOBC) boards .Edward Plummer is reviewing the position of the company in 1987 so that operations for 1988 can be planned effectively.
ORDER PROCESSING The flow diagram of Donner’s order processing process is shown below:
Prepare a bid for customers/clients
Estimate Labour and Material Costs
No
Bid Accepted?
No Order Processing
YES
Rush Order or Normal Order? NORMAL
RUSH
Order Size>1000?
Promise Delivery in 3 weeks
No
Promise Delivery in YES 5 weeks
Log Blueprint & factory order sent to supervisor
Send Specifications and documents to purchasing agents Finalize Scheduling Decisions
Release Order to Shop Floor
The Manufacturing Process for the Printed Circuit Boards at Donner Company The manufacturing process comprises of 3 major steps: Preparation Stage: This stage deals with preparation. After placing the order, customers
provide master artwork to the company. The master artwork contains image of the circuit design which is converted into a negative image showing the actual dimensions. After this the company buys epoxy sheets which are cut in to 8- 12”x18” panels that have holes drilled into them to fix them to the table during Image Transfer Stage.
Preparation Stage
Receive master artwork from the customer
Create negative image from received artwork
Buy Epoxy Sheets of size (36” x 48”)
Inspection of Epoxy sheets
Cut sheets into 8 12”x18” panels
Image Transfer Stage: Here, the panels are pinned to the table and approx 500 holes are
drilled into them as per customer design requirements. The drilling can be done either manually or using CNC Micronic Jr. High Speed drills and programmed drilling patterns that are fed to the CNC. After this, drilling and metallization is done followed by DFPR coating and they are exposed to UV rays for etching the circuit pattern onto the panel. After etching, panels are electroplated with the bare copper conductors with tin and etching out the exposed DFPR.
Image Transfer Stage
Manual Drilling
Pin panel to drill table
Drilling process
Metallization
? Drilling by CNC Micronic Jr. High Speed Drill
Washed scrubbed and coated withDFPR
Tin Stripping
Chemical Etching of exposed DFPR
Tin Plating
Electroplating bare copper conductors
Wash out unexposed DFPR using DFPR developing machine
Lay negative of artwork on the panel and expose to UV Light
Fabrication Stage: In this stage, panel is processed through solar mask and silk-screening, it leaves behind a protective epoxy coating over the circuit traces The exposed copper is covered with solder due to solder –bath process. In profiling, panels are cut and sized according to customer required dimensions. Profiling can be done, either by CNC routing or by Stamping. This is followed by visual inspection and electrical testing. Now circuit boards are sent for packaging and shipping thereby completing the process.
Fabrication Stage
Solder-mask
Molten Solder-bath
CNC Routing
Packaging and Shipping
Panel Profiling
Punch Press
Visual Inspection and Electrical Testing of circuit boards
Order size to schedule on CNC Router and Punch Press: If we consider “m” as the order size, Setup time(min) 150 50
CNC router Punch Press
Run time(min) 0.5/circuit board 1.0/circuit board
Total time(min) 150+0.5m 50+m
Time taken by CNC router = 0.5m+150 Time taken by Punch Press = m+50 Equating and solving the above two equations, we get m=200. If we take an order size of 210, Time taken by CNC Router= 0.5*210+150 =255 min; Time taken by Punch Press= 210+50=260 min. If we take an order size of 100, Time taken by CNC Router=0.5*100+150=200 min; Time taken by Punch Press=100+50=150 min. Hence, if m>200 CNC Router should be used and if m<200 Punch Press should be used. CNC Router Punch Press
Order size > 200 Order size < 200
Time needed to produce an order size of 8 circuit boards , 80 circuit boards and 800 circuit boards:
Order size
Total time(min)
Time taken/ Board (min/ board)
8
694.05
86.76
80
3889.50
48.62
800
5369.00
6.71
Note – The above calculations have been done on excel sheet, and the corresponding table is shown in the subsequent pages.
No of Boards = 8 Standard Production Time Times (in minutes)
Total Run
Operating
Time Operation Type
Setup
Run
Time
PREPARATION Artwork Generation
29
0
29
Inspect & Shear
20
0.5/panel
0.5
20.5
Punch Tooling Holes
10
0.5/panel
0.5
10.5
Manual
15
0.08/hole
320
335
CNC Drill
240
0.004/hole
0
0
Metallization
10
0.75/panel
0.75
10.75
IMAGE TRANSFER Drill
Dry Film Photoresist 1. Panel Prep 2. Laminate & Expose
5
0.20/panel
0.2
5.2
20
2/panel
2
22
3. Develop
20
0.2/panel
0.2
20.2
Electroplate
25
8.5/panel
8.5
33.5
Strip DFPR
5
0.2/panel
0.2
5.2
Etch & Tin Strip
10
0.2/panel
0.2
10.2
Soldermask
45
1.5/panel
1.5
46.5
Solder Dip
30
0.5/panel
0.5
30.5
Punch Press
50
1.0/board
8
58
Inspect and pack
45
1.5/board
12
57
FABRICATION
Profile
Total
694.05
No of Boards = 80 Standard Production Time Times (in minutes)
Total Run
Operating
Time Operation Type
Setup
Run
Time
PREPARATION Artwork Generation
29
0
29
Inspect & Shear
20
0.5/panel
5
25
Punch Tooling Holes
10
0.5/panel
5
15
Manual
15
0.08/hole
3200
3215
CNC Drill
240
0.004/hole
0
0
Metallization
10
0.75/panel
7.5
17.5
IMAGE TRANSFER Drill
Dry Film Photoresist 1. Panel Prep 2. Laminate & Expose
5
0.20/panel
2
7
20
2/panel
20
40
3. Develop
20
0.2/panel
2
22
Electroplate
25
8.5/panel
85
110
Strip DFPR
5
0.2/panel
2
7
Etch & Tin Strip
10
0.2/panel
2
12
Soldermask
45
1.5/panel
15
60
Solder Dip
30
0.5/panel
5
35
Punch Press
50
1.0/board
80
130
CNC Router
150
0.5/board
0
0
Inspect and pack
45
1.5/board
120
165
FABRICATION
Profile
Total
3889.5
No of Boards = 800 Standard Production Time Times (in minutes)
Total Run
Operating
Time Operation Type
Setup
Run
Time
PREPARATION Artwork Generation
29
0
29
Inspect & Shear
20
0.5/panel
50
70
Punch Tooling Holes
10
0.5/panel
50
60
Manual
0
0.08/hole
0
0
CNC Drill
240
0.004/hole
1600
1840
Metallization
10
0.75/panel
75
85
IMAGE TRANSFER Drill
Dry Film Photoresist 1. Panel Prep 2. Laminate & Expose
5
0.20/panel
20
25
20
2/panel
200
220
3. Develop
20
0.2/panel
20
40
Electroplate
25
8.5/panel
850
875
Strip DFPR
5
0.2/panel
20
25
Etch & Tin Strip
10
0.2/panel
20
30
Soldermask
45
1.5/panel
150
195
Solder Dip
30
0.5/panel
50
80
Punch Press
50
1.0/board
0
0
CNC Router
150
0.5/board
400
550
Inspect and pack
45
1.5/board
1200
1245
FABRICATION
Profile
Total
5369
Specific actions to be taken by Mr. Plummer to reduce the average flow time of jobs processed by Donner:
1. Specialization of job tasks should be done to make the manufacturing process more systematic and organized. Each worker has to be assigned to a particular job task. This will prevent constant shifting of workers from one job to another in a haphazard fashion and reduce inefficiency. Also recruiting new workers may be considered, as specialization of job task may require increase in workforce. 2. Wastage of time can be avoided by proper positioning of equipment. There are certain cases in which more time is taken as equipment of subsequent process is not located in the vicinity. Hence, considerable improvement can be achieved as intermediate time elapsed between the processes could be minimized. 3. Rush orders should be dealt with separate workers and resources to ensure better job flow. Also, the procurement process has to be worked upon as delay in delivery of raw materials creates hassles in the scheduling job and subsequently in the entire process (only after raw materials are received, factory order and blueprint is sent forward). Problem faced due to varying size of orders:
Donner is trying to do too much by accepting a mix of small and large orders and this policy is creating the following impact: Impact on Shop Floor: 1. Random and non - uniform allocation of workers in various tasks leading to confusion and decrease in productivity. 2. Wastage of time due to unorganized functioning, causing unnecessary delays in finishing the job. 3. Difficulty in determining future course of action due to the varied order size being handled. Hence, the upcoming effects cannot be predicted when work piles up and it is difficult to counter bottlenecks prevalent. Impact on various performance measures: 1. Adherence to delivery time becomes difficult. 2. Compromise on the quality standards which leads to increase in rejection rates. 3. Difficulty in monitoring individual employee performance. 4. Reprocessing creates additional costs. 5. Reduction in overall efficiency as compared to competitors.
Conclusion
Donner Company has a lot to do to improve the efficiency of its operations. The bottlenecks in the process should be dealt with appropriately and specialization of job task should take place. Wastage of time should be avoided by proper positioning of factory equipment and the procurement process should be worked upon to ensure better flow. Also, it should not handle varied order sizes. All these considerations can help it improve its productivity and efficiency.