Solution Partner Certification Workshop S7-1500
Contents 1.
1
System Overview .................................................................................................... 1-2 1.1. 1.1.1. 1.1.2. 1.1.3. 1.1.4.
Positioning of the Modular S7 Controllers ..........................................................................1-3 Positioning of the S7-1500.................................................................................................1-4 Highlights of the SIMATIC S7-1500 System .......................................................................1-4 Overview of Available Central Modules..............................................................................1-5 Overview of Available Signal Modules (Central) .................................................................1-5
1.2. 1.2.1. 1.2.1.1. 1.2.1.2. 1.2.1.3. 1.2.2. 1.2.2.1. 1.2.2.2. 1.2.2.3.
SIMATIC S7-1500: Modular Controller for the Mid to Upper Performance Range ...............1-6 SIMATIC S7-1500: Modules ..............................................................................................1-7 SIMATIC S7-1500: Installation and Mounting Positions......................................................1-9 SIMATIC S7-1500: Module Assembly .............................................................................. 1-10 SIMATIC S7-1500: Connection Technology/Front Connector........................................... 1-10 SIMATIC S7-1500: CPU Display Overview.................................................................. 1-12 SIMATIC S7-1500: CPU Display Menu and Colors .......................................................... 1-13 SIMATIC S7-1500: CPU Display Operations.................................................................... 1-14 SIMATIC S7-1500: CPU-Display Access and Anti-theft Protection ................................... 1-14
1.3.
SIMATIC S7-1200/1500: Technology Functions............................................................... 1-15
1.4. 1.4.1. 1.4.2. 1.4.3. 1.4.4.
SIMATIC S7-1200/1500: Memory Card(s) Overview ........................................................ 1-16 SIMATIC S7-1200/1500: Memory Card Properties........................................................... 1-17 SIMATIC S7-1200/1500: Memory Model.......................................................................... 1-18 SIMATIC S7-1200/1500: Memory Concept with CPU Memory Reset ............................... 1-18 SIMATIC S7-1200/1500: Memory Concept with CPU Reset to Factory Settings ............... 1-19
1.5. 1.5.1. 1.5.2. 1.5.3. 1.5.4. 1.5.5. 1.5.6.
Distributed I/O .................................................................................................................1-21 Positioning of the Distributed Signal Modules .................................................................. 1-21 Overview of Available Signal Modules (Distributed) ......................................................... 1-21 ET 200SP: Size-optimized Modular Distributed I/O System..............................................1-22 ET 200SP: Configuration and Maximum Number of Modules ........................................... 1-23 ET 200MP: Modular Distributed I/O System ..................................................................... 1-24 ET 200MP: Configuration and Maximum Number of Modules .......................................... 1-25
1.6. 1.6.1.
Tips and Tricks................................................................................................................ 1-26 Power Budgeting for System Power Supply of S7-1500 and ET200MP ............................ 1-26
1.7. 1.7.1. 1.7.2.
Exercises: Preparing the Training Area for HW Commissioning ....................................... 1-27 Exercise 1: Resetting the CPU to Factory Settings using the Display ............................... 1-27 Exercise 2: Determining the Modules of the Training Area ............................................... 1-28
1.8.
Additional Information...................................................................................................... 1-29
1.9. 1.9.1. 1.9.2. 1.9.3. 1.9.4.
Firmware Update............................................................................................................. 1-30 Firmware Update Offline using SIMATIC Memory Card with the Windows Explorer ..... 1-30 Firmware Update: Offline using STEP7 by means of Card Creation in the TIA Portal ...... 1-31 Firmware Update: Online using STEP 7 in the TIA Portal ................................................. 1-32 Firmware Update Important Facts ............................................................................... 1-33
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-1
Solution Partner Certification Workshop S7-1500
1.
System Overview
This chapter provides an overview of the S7 system family. Participants will become familiar with the new Controller S7-1500. They will gain an overview of modules and submodules.
1-2
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.1.
Positioning of the Modular S7 Controllers
SIMATIC S7 The programmable logic controllers can be divided into the micro PLC (S7-1200) and the mid/upper (S7-1500) performance ranges. The existing lower/mid performance range (S7-300) and the mid/upper performance range (S7400) will be covered in future by an S7-1500 system.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-3
Solution Partner Certification Workshop S7-1500
1.1.1.
Positioning of the S7-1500
At the start of the introduction of the new S7-1500 CPU system, modular CPUs are only available up to the mid performance range.
1.1.2.
1-4
Highlights of the SIMATIC S7-1500 System
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.1.3.
Overview of Available Central Modules
The S7-1200 and S7-1500 product range will be expanded in the next years such that the S7-300 and even the S7-400 can be completely replaced.
1.1.4.
Overview of Available Signal Modules (Central)
The S7-1200 and S7-1500 signal module product range will be expanded in the next years such that the S7-300 and even the S7-400. Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-5
Solution Partner Certification Workshop S7-1500
1.2.
SIMATIC S7-1500: Modular Controller for the Mid to Upper Performance Range
Features Modular control system for the mid to upper performance range Scaled CPU range Display for basic CPU settings (system time, interfaces...) and for calling diagnostic and status information (diagnostic buffer, message display, CPU state...) Extensive range of modules High performance I/O bus for efficient process interfacing via central I/O Can be expanded up to 32 modules in one tier Currently only single-tier assembly possible. Multi-tier assembly using distributed ET200MP. Can be networked with PROFIBUS or PROFINET Slot rules left of the CPU: 1x power supply (PM or PS) right of the CPU: signal modules (digital, analog), technology modules, communication modules and further power supplies No slot rules for modules to the right of the CPU
1-6
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.2.1.
SIMATIC S7-1500: Modules
Slot Rules 1x PS/PM Slot 0 1x CPU in Slot 1 As of Slot 2 any Signal Modules Digital input modules:
24VDC, 230VAC
Digital output modules:
24VDC, 230VAC
Analog input modules:
voltage, current, resistance, thermocouple
Analog output modules:
voltage, current
Communication Modules (CP - Communication Processor, CM - Communication Module) Point-to-point connection PROFIBUS PROFINET CPs and CMs are both communication modules. CPs have, as a rule, somewhat more functionality than CMs (e.g. own web server, firewall, or the like). Technology Modules (TM - Technology Module) Counting Position sensing
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-7
Solution Partner Certification Workshop S7-1500
Power Supply I/O modules in the central rack of the S7-1500 require a system power supply via the backplane bus (communication connection to the CPU) and a load power supply (input or output circuits for sensors/encoders and actuators). PM - Power Module Load Power Supply supplies modules with 24VDC for input and output circuits as well as sensors/encoders and actuators If the CPU is supplied 24V via a load power supply (PM), it supplies the system power supply of 12W for the first inserted I/O modules. PS - Power System System Power Supply supplies S7-1500 modules in the central rack via the backplane bus Each CPU offers a system power supply of 12W for the first inserted I/O modules. Depending on the I/O modules used, further power segments have to be set up, as required. A system power supply (PS) can also supply the load circuit for 24VDC modules in addition to the CPU. Power Supply and Power Segments of the I/O Modules It is necessary to set up power segments in the central rack for larger configurations or configurations with greater I/O module power requirements (as a rule, when using CP, CM, TM). A maximum of 3 power segments can be set up per rack (1xCPU segment plus 2 more). If the configuration includes additional power segments, additional system power supply modules (PS) are inserted to the right next to the CPU. The CPU continues to control all modules of the rack. Only the system power supply of the I/O modules is subdivided here. Example of a Small S7-1500 Configuration
Example of an S7-1500 Configuration with a 2nd Power Segment
Interface Modules for Expansion Rack A central multi-tier assembly is not planned. An expansion can be realized using the distributed ET200MP I/O system.
1-8
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.2.1.1.
SIMATIC S7-1500: Installation and Mounting Positions
Installation The modules are mounted on an S7-1500 profile rail. Bus Connector If the installation is made on the profile rail, the modules are then connected with the Uconnector. The U-connector establishes the mechanical and electrical connection between the modules and is included with every I/O module. Mounting Positions A horizontal or vertical mounting is possible. Caution! With a vertical mounting, the maximum allowed ambient temperature is 20 °C lower (ambient temperature 0 to 40 °C). Integrated Mounting Rail For the S7-1500 CPU, there is a profile rail on which components can also be mounted according to EN 60715. With that, even terminals, miniature circuit breakers, small contactors or similar components can be mounted in addition to the S7-1500.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-9
Solution Partner Certification Workshop S7-1500
1.2.1.2.
SIMATIC S7-1500: Module Assembly
The module assembly is similar to that of the S7-300. Click-In Assembly Optionally, you can order an insert-able square profile that enables a click-in assembly of modules instead of screws.
1.2.1.3.
SIMATIC S7-1500: Connection Technology/Front Connector
By swinging up the release latch, you can pull the front connector and remove it from the module.
1-10
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
Properties of the Front Connector In each case 40 terminals Clamping techniques: Screw-type terminal SIMATIC TOP connect System wiring for the connection of sensors/encoders and actuators S7-1500 front connector wired with 20 or 40 single conductors (prefabricated) Prewiring Position The front connector latches up in the front cover. In this position, the front connector still juts out of the module, but the front connector and the module are not yet electrically connected. Jumper Links The jumper links can be inserted in the front connector in four places for easier set up of load groups. That is, looping the supply voltage to several potential groups. Only one connection from left to right exists! Automatic Coding of the I/O Modules This enables a faster and safer exchange of the front connector.
Shield Connection (Analog Signals, Signals to Technology Modules) The cable clamp is a pluggable mounting support for modules with EMC-critical signals (e.g. analog modules, TMs) and enables the low impedance connection of cable shielding and minimum installation times. Cable clamp and shielding terminal are included with analog modules and TMs.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-11
Solution Partner Certification Workshop S7-1500
Two Front Door Latching Positions At the bottom of the front cover there are 2 different latching positions for different space requirements of the conductor bundle. Cable storage space that grows with the need (AWG cabling) American Wire Gauge (AWG) is an American standard measure for copper wires which defines the wire strength and the allowed damping, whereby a lower AWG value represents a thicker wire.
1.2.2.
1-12
SIMATIC S7-1500: CPU Display
Overview
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.2.2.1.
SIMATIC S7-1500: CPU Display Menu and Colors
Depending on the current CPU state, the color on the Display varies. Available languages are the available user interface languages of STEP7. Additional Symbols in the Status Information Password is configured but not entered Password is configured and entered An Alarm exists A Force job is active on the CPU
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-13
Solution Partner Certification Workshop S7-1500
1.2.2.2.
SIMATIC S7-1500: CPU Display Operations
In the bottom Display line, "ESC" appears on the left or "OK" on the right when one or both buttons can be operated to execute a function.
1.2.2.3.
SIMATIC S7-1500: CPU-Display Access and Anti-theft Protection
The settings for Standby mode and Energy-saving mode can be defined via the Display as well as via the device configuration of the CPU.
1-14
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.3.
SIMATIC S7-1200/1500: Technology Functions
High-speed Counters Up to 6 high-speed counters, 3 at 100 kHz and 3 at 30 kHz are available for precise monitoring of incremental encoders, frequency counting or counting of highly frequent process events. Motion To control rotary speed, position or pulse duty factor, a total of 2 PWM outputs (pulse width modulation) are available. Application examples are, for example, controlling the speed of a motor, position of a valve, or the mark-to-space ratio for a heating element. For rotary speed and position controls, a total of 2 PTO outputs at 100 kHz (pulse train output) are available. It supplies a pulse train for controlling speed and position of stepper or servo motors. PID For simple closed-loop control tasks, up to 16 PID control circuits with automatic PID adjustment and tuning control panel are available.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-15
Solution Partner Certification Workshop S7-1500
1.4.
SIMATIC S7-1200/1500: Memory Card(s) Overview
Memory Card Binding – Copy Protection The executability of the program can be bound to the serial number of the card. Load Memory S7-1500 This has no integrated load memory and therefore it is imperative that a card is inserted. S7-1200 This has an integrated load memory. Here, an inserted memory card can replace (expand) the integrated load memory or the card can be used for program updates (distribution of programs). Distribution of Programs
only S7-1200
The use as Transfer card (card mode = "Transfer") is only supported by the S7-1200. Here, a program can be downloaded into the CPU without a PG if a card is inserted. Archiving of Data
only S7-1500
It is possible to archive process values on the card. The use of this functionality influences the operating life of the Memory Card
1-16
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.4.1.
SIMATIC S7-1200/1500: Memory Card Properties
Insertion of SD Cards or MMC Cards Contacts must face upwards! Number of Delete/Write Operations With an ambient temperature of up to 60 °C, at least 500,000 delete/write operations are possible on the SIMATIC Memory Card.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-17
Solution Partner Certification Workshop S7-1500
1.4.2.
SIMATIC S7-1200/1500: Memory Model
1.4.3.
SIMATIC S7-1200/1500: Memory Concept with CPU Memory Reset
Initiation of Functions STEP7 online function
Memory Reset in Task Card "Test"
Display (only S7-1500)
Main menu "Settings", submenu "Reset"
Function Execution with Inserted SIMATIC Card CPU is reset to the loading state of the user program. 1-18
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
Function Execution without or with Deleted SIMATIC Card CPU has no user program 1st. interface (X1) has retained parameters (e.g. X1=PN has retained its IP address) All other interfaces are deactivated, that is, without parameters
1.4.4.
SIMATIC S7-1200/1500: Memory Concept with CPU Reset to Factory Settings
Initiation of Functions STEP7 online function
Reset to factory settings in "Online & diagnostics"
Display (only S7-1500)
Main menu "Settings", submenu "Reset"
Function Execution with Inserted SIMATIC Card CPU is reset to the loading state of the user program Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted Function Execution without or with Deleted SIMATIC Card Factory reset using STEP7 online function CPU has no user program
Selection for X1 interface All other interfaces are deactivated, that is, without parameters Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted Factory reset using Display (only S7-1500) CPU has no user program All interfaces are deactivated, that is, without parameters Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-19
Solution Partner Certification Workshop S7-1500
1-20
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.5.
Distributed I/O
1.5.1.
Positioning of the Distributed Signal Modules
1.5.2.
Overview of Available Signal Modules (Distributed)
The ET200SP and ET200MP product range will be expanded in the next years such that these two product lines completely cover the applications of the ET200S and ET200M. The ET200pro (interface modules for connection to PROFINET or PROFIBUS) in the degree of protection IP65/67for use directly at the machine will continue to be offered. Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-21
Solution Partner Certification Workshop S7-1500
1.5.3.
ET 200SP: Size-optimized Modular Distributed I/O System
For STEP7 V11 there is an HSP and for STEP7 V5.5 or third-party systems there is a GSDML file. To expand the module spectrum, CMs (AS-i master, AS-i F-modules, IO-link master), a TM (1 POS input) and a motor starter are in the planning stage. 2d Matrix Code This code is used for identifying modules and can be photographed or decoded by SmartPhones, PDAs, iPhones and the like. With the ET200SP modules, the code contains an Internet link to the product page of the associated module.
Color Coding of the Module Class Each module class is marked with a colored square to make it easier to recognize the module functionality.
1-22
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.5.4.
ET 200SP: Configuration and Maximum Number of Modules
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-23
Solution Partner Certification Workshop S7-1500
1.5.5.
ET 200MP: Modular Distributed I/O System
The ET200MP enables the distributed connection of S7-1500 series central I/O modules. Connection is made using an interface module. In the first delivery stage, only one PROFINET interface module is offered. For STEP7 V11, STEP7 V5.5 or third-party systems there is a GSDML file.
1-24
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.5.6.
ET 200MP: Configuration and Maximum Number of Modules
If a suitable 24VDC supply is available, it can supply the IM from the front even without a PS module in the 1st. slot. If only a few I/O modules or low-performance I/O modules are used on the IM155, they are "supplied by the system" by the IM155 through the backplane bus. Otherwise, power segments are also to be set up just like the configuration of a central S7-1500 rack. PS module and front-side 24VDC supply to IM155: System power supply of PS + System power supply of integrated PS of IM155 _ = Feed-in power of system power supply in Power Segment 1
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-25
Solution Partner Certification Workshop S7-1500
1.6.
Tips and Tricks
1.6.1.
Power Budgeting for System Power Supply of S7-1500 and ET200MP
If only a few I/O modules or low-performance I/O modules are used in the central rack of the CPU or on the IM155, they are "supplied by the system" by the CPU or IM through the backplane bus. It is necessary to set up power segments for larger configurations or configurations with greater I/O module power requirements (as a rule, when using CP, CM, TM). A maximum of 3 power segments can be set up per rack central CPU rack: 1xCPU segment plus 2 more segments ET200MP rack: 1x IM155 segment plus 2 more segments If the configuration includes additional power segments, additional system power supply modules (PS) are inserted to the right next to the CPU or IM155. The CPU or the IM155 continues to control all modules of the rack. Only the system power supply of the I/O modules is subdivided here. Power Budget The power requirement of each module is specified in the technical data. From it, the power budget can be calculated and the need for further system power supplies can be determined. Once the hardware is configured, a power budget of the device configuration can be taken from the properties of the CPU or the ET200MP interface module (IM155).
1-26
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.7.
Exercises: Preparing the Training Area for HW Commissioning
1.7.1.
Exercise 1: Resetting the CPU to Factory Settings using the Display
Task The training area is to be prepared for the next exercises. What to Do 1. Remove the SIMATIC Memory Card from the CPU Lift up the CPU Display and remove the card from the CPU pressing the centre of the card releases the card 2. Carry out a Reset to Factory Settings using the CPU Display Using the cursor keys, select the menu item
and choose the relevant function.
3. Checking the function execution Using the cursor keys, select the menu item successful.
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
or
and check that the reset was
1-27
Solution Partner Certification Workshop S7-1500
1.7.2.
Exercise 2: Determining the Modules of the Training Area
Task You will make some notes and get an overview of the components of the training area. In the next exercises, it is necessary to know detailed information about the modules. Type designation and order number can be found on the module housing. The CPU device version can be accessed using the Display. Device versions (firmware, operating system) of the other modules are determined later using online functions. Addresses are given later. Enter the type designation and order number for the above-mentioned modules in the overview on the next page. Device type You will find the type designation on the module nameplate or imprinted at the top of the housing front. CPU device version The CPU version can be accessed using the Display. Order Number You will find this on the module nameplate or imprinted at the top or bottom of the housing front.
1-28
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
1.8.
Additional Information
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-29
Solution Partner Certification Workshop S7-1500
1.9.
Firmware Update
Procuring the new firmware is always the first step. The next steps depend on the selected update possibility.
1.9.1.
1-30
Firmware Update Explorer
Offline using SIMATIC Memory Card with the Windows
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
When the CPU or the Display is updated, Step 7 is necessary in any case. However, this is also recommended at the end of every module update. Status of the Update in the Display (only S7-1500) Only the S7-1500 has a Display. Status of the Update with LEDs If the middle LED (red, error) lights up, the update was not successfully completed or it could not be carried out.
Necessary Firmware Update Files Directory with FW files (FWUPDATE.S7S) and data ID file (S7_JOB.S7S) Empty Card (Windows Explorer)
Do NOT delete hidden files!!!
1.9.2.
Firmware Update: Offline using STEP7 by means of Card Creation in the TIA Portal
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-31
Solution Partner Certification Workshop S7-1500
Necessary Firmware Update File e.g. FW file (MLFB_ausgabe.upd) Card Contents The SD card for the update does not necessarily have to be deleted first. During creation you are prompted:
Yes Card is deleted and update card is created No The update is only added to the card contents and the card type is set to "Update firmware". This can only be done for updating the Display since the program is active and CPU + I/O modules cannot be updated in this state. For updating the CPU or the Display, an empty card is necessary in order to conclude 7 the update (see Step ). For that reason, it is generally recommended to delete the "Program" card or to use a separate card for updates.
1.9.3.
1-32
Firmware Update: Online using STEP 7 in the TIA Portal
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
Solution Partner Certification Workshop S7-1500
Before running the update, the appropriate *.upd must be selected.
Before running an update of I/O modules, the CPU should be switched to STOP, if the active user program uses this module. Wait until update is completed...
CPU Update Advantage: The current "Program" card is not changed. Attention ! The retentiveness is however deleted, that is, the program is then reset to the loading state.
1.9.4.
Firmware Update
Important Facts
During an update, the supply voltage must not fail or be removed. Distributed I/O without memory card is exclusively update-able online using STEP7. After updating the CPU or the Display (only S7-1500), the CPU should be switched off, an empty memory card inserted in the CPU and the CPU switched back on. It is possible to do a simultaneous update of several modules offline using the memory card. Respective firmware update files are stored in the folder for Firmware update The Sequence is Relevant if Several Module Types are Updated 1. Update of the Display firmware (only S7-1500) 2. Update of the central I/O modules 3. Update of the distributed I/O modules 4. Update of the Boot loader of the CPU 5. Update of the CPU
Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01
1-33