Nirma Institute of Technology ( Approved by All India Council for Technical Education – New Delhi and Affiliated to Gujarat University, Ahmedabad )
Gandhinagar-Sarkhej Highway Tragad Patia, Post-Chandlodia, Via-Gota, Chharodi, Ahmedabad-382481. Ph.: (079) 3741911-15 Fax : (079) 3741917 E-mail :
[email protected]
CERTIFICATE This is to certify that the under mentioned students of B.E. IV, Semester VIII, (Instrumentation and Control), Nirma Institute of Technology, have been working on the project titled ‘Autonomous and Semi-autonomous Robots for Coordinated Task Solving (Robocon 2004)’ at Nirma Institute of Technology under my guidance for the fulfillment of their curriculum requirement, since December, 2003. They have been regular, sincere and hard working to try and successfully completed their project assignment. Abhijit Karnik Harsh Satyapanthi
Prof. B. B. Kadam Project Guide and Coordinator Robocon 2004 Nirma Institute of Technology
DATE:
CERTIFICATE NIRMA INSTITUTE OF TECHNOLOGY AHMEDABAD
I hereby certify that the following students of B.E. IV, Semester VIII, Instrumentation and Control have satisfactorily completed their project on ‘AUTONOMOUS AND SEMI-AUTONOMOUS ROBOTS FOR COORDINATED TASK SOLVING (ROBOCON 2004)’ at
NIRMA INSTITUTE OF TECHNOLOGY
SR. NO.
NAME
ROLL NO.
1
ABHIJIT KARNIK
00IC28
2
HARSH SATYAPANTHI SATYAPANTHI
00IC44
(Mr. Vaibhav Gandhi) INTERNAL GUIDE
DATE:
(Dr. M.D. Desai) HEAD OF THE ELECTRICAL ENGINEERING DEPARTMENT
Project Report th 8 Sem. I.C.
ACKNOWLEDGEMENT: As students of the final year of engineering (Instrumentation & Control), we are th
required to undertake a project as a part of our curriculum. Our project for 8 Semester is titled
“AUTONOMOUS
AND
SEMI-AUTONOMOUS
ROBOTS
FOR
COORDINATED TASK SOLVING”. Herewith is encapsulated a report o f the same. In our attempt, we have come to realize that robotics is a field which is not just an isolated field on its own. It is the synthesis of a number of concepts from all the major engineering fields. Hence our journey has had a number of guides, each one from a different field. In submitting this report, we, the undersigned, would like to take the opportunity to thank all these people, without whose help our modest endeavor would never have seen the light of the day. Thereby we take immense pleasure in thanking Prof. B. B. Kadam (Prof. Electrical Dept.) who is our guide, Dr. M.D. Desai (HOD, Electrical Dept.), Mr. Vaibhav Gandhi (Lecturer, IC Dept., & Internal Guide), Prof. D. M. Adhyaru (Asst. Prof., IC Dept.), Ms. Gauri Mudaliar (Lecturer, Mechanical Dept.), Mr. Chintan Bhatt (Lecturer, IC Dept.), Mr. Sachin Gajjar (Lecturer, EC Dept.), Mr. Dishang Trivedi (Lecturer, Electrical Dept.), Mr. H.K. Patel (Lecturer, IC Dept.), Mr. Navinbhai Shah (Applications Engineers). We would also like to acknowledge the enthusiastic support that was given to us by the management of college and faculty of I.C. Dept., who not only gave us moral support but were actively interested in our project through all its ups and downs.
Last but not the least; we would like to acknowledge the unquestioning and tireless support from our families.
Abhijit Karnik Harsh Satyapanthi
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
FOREWORD: The word robot was coined by the Czech writer Kapek in his play ‘Rossum's Universal Robots’. Since then countless devices have been created and have been associated with the word ‘Robot’. The works of Isaac Asimov have laid the foundation of sociology pertaining to the use of robots instead of humans and the word ‘Robotics’ was also coined by him. In today’s world, work on robots, that resemble and look almost human, and others which don’t resemble humans in any way, progresses in leaps and bounds. The world has forerunners in this technology like MIT, CMU, Sony, Honda etc. In this world of ASIMO, AIBO, Packbot etc., we have made an attempt to create machines which we dare call ‘Robots’.
In this era where organizations like ABU – Asia Pacific Broadcasting Union are organizing robot contests like Robocon we have made an attempt to make robotic systems which could send and receive communication signal amongst them and complete the task assigned to them with coordinated efforts. Today when technology is developing faster then a blink of an eye and the competition is tough to win at any stage may it be national or international, we have put in tireless efforts to implement the technology in simpler and effective form to compete against some of the best in field of robotics in the country.
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
INTRODUCTION:
This report is the documentation of all the efforts put into the making of Autonomous and Semi-autonomous Robots by us as the Participating Team Members of Robocon 2004 Team of Nirma Institute of Technology. The title of the project was
coined as:
‘Autonomous ‘Autonomous and Semi-autonomous Semi -autonomous Robots for Coordinated Task Solving’, These robots are targeted to perform a coordinated task in the Game Arena of Robocon ’04 where the task to be performed is common for all the participant teams from all the institutions and nations. This report explains the technology and heuristics involved in making of the robots and how the task is planned to be completed using the same.
The report is divided into 6 sections. Each section deals with the project from a different viewpoint. The first section deals with the explanation of the Contest Theme of Robocon 2004 and pertaining details. The second section deals with the purpose of the robots and the features included in the robots. The third section deals with the operational description of the different modules of the robot which thereby allow the proper functioning of the features that we have planned to implement on the robot. The fourth section is the hardware and software section wherein the mind and the nerve control of the robot is explained. The fifth section explains how the research and development as well as heuristics and ideas have played a major role in shaping up this project. The last section is the annexure containing the selected sections of the datasheets of the electronic components used in our project, bibliography and the information about the sources of the systems components.
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
SECTION 1 ABU – Asia Pacific Robot Contest Robocon 2004 Seoul
The ABU – Asia Pacific Broadcasting Union has been organizing the Asia Pacific Robot Contest since 2002 which is better known as ‘Robocon’ in which the teams from the member nations of the Asia Pacific Broadcasting Union participate.
This contest is being organized in order to create the awareness for the field of Robotics amongst the students at undergraduate level. The undergraduate students are encouraged to participate and finally take interest and contribute to the field of Robotics. The contest is held first at the National level in all the participating countries. In the national level contest the teams or undergraduate students from various colleges and institutions participate and the winning team of the contest represents the country at the international level.
For the contest a theme and rules are declared by the Robocon Committee and the theme and ruler remain common for all the competitions at national levels in various countries as well as for the international contest.
Robocon 2004 will be the third consecutive time this contest will take place. Robocon 2004 is to be held in Seoul, Korea and the Theme and Rules of the contest are mentioned next.
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
Theme and Rules – Robocon 2004 Seoul The aim of this robot contest is to make machines by hand from design to construction construction which will be most suitable to compete in the below contest theme and rules.
Reunion of Separated Lovers, ‘Gyeonwoo and Jiknyeo’ The theme of this contest is based based on a love story in in Asian legend. A couple called ‘Gyeonwoo & Jiknyeo’ are forced to be apart from each other with the Milky Way between between them due to their laziness. Magpies and crows crows which feel sorry for the couple fly up to the sky and build a bridge with their bodies to get the couple together. together . It is called ‘Ojak Bridge’ (Bridge of Crow and Magpie). The couple get together together by crossing ‘Ojak ‘Ojak Bridge’ once a year, on th
July 7 by lunar calendar. calendar. It always rains rains on this day and we we say that it is the the tears of joy from Gyeonwoo and Jiknyeo for their reunion. The aim of this contest is to compete for accomplishing “Reunion” by completing the unfinished bridge and carrying Golden Gift by Automatic Machine from “Gyeonwoo Zone (Zone A)” to “Jiknyeo Zone (Zone B)”. The duration of each match is three minutes.
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Project Report th 8 Sem. I.C.
1. THE GAME FIELD
The following three pages show and explain the layout and details of the Game Field to on which the contest takes place.
2. OBJECTS (GIFT/GOLDEN GIFT/BRIDGE)
The details pertaining to the Gift, Golden Gift and the Bridge and Bridge parts are also mentioned in the floor plan and layout of the game field in the following three pages.
Nirma Institute of Technology
Smaller Bridge Part (EPS)
Big Bridge Part (EPS) 3.2 0.1 kg
Game Field
Small Bridge Part (EPS)
Big Bridge Part (EPS)
Big Bridge Part (EPS)
Jiknyeo's Hands
Manual Machine Common Zone
Jiknyeo Zone (Zone B)
2 Point Scoring Bin
Ojak Bridge
Red Milky Way Zone Blue Milky Way Zone
1 Point Scoring Bin
Gyeonwoo Zone (Zone A)
Golden Gift (EPS) 2.3 0.1 kg Gift (EPS) 0.4 0.05 kg
Red Manual Machine Start Zone
Blue Manual Machine Start Zone
Red Automatic Machine Start Zone
Blue Automatic Machine Start Zone
Project Title
ABU Asia-Pacific Robot Con test 2004 Seoul "Reunion of Separated Lovers, Gyeonwoo & Jiknyeo " SCALE:
A3
SHEET 1 OF 3
Game Field (Dimension) 1000
896.25
1000
100
0 0 4
0 0 9 2
0 0 1 4
500
100
1 00
2 0 0 0 0 3
10
100
° 5 2 . 4 1
° 5 2 . 4 1
100
0 0 0 4 1
° 5 2 . 4 1
1/5 1000 0 0 0 1
3 0 0 5
Inner Wall 600
400 Outer Outer Wall 50 1200
0 0 2 1
0 0 5
Inner Wall 100 1950
50
5000
Outer Wall 150
14000
Project Title
ABU Asia-Pacific Robot Con test 2004 Seoul "Reunion of Separated Lovers, Gyeonwoo & Jiknyeo " SCALE:
SHEET 2 OF 3
A3
Game Field (Dimension) 1000
896.25
1000
100
0 0 4
0 0 9 2
0 0 1 4
500
100
1 00
2 0 0 0 0 3
10
100
° 5 2 . 4 1
° 5 2 . 4 1
100
0 0 0 4 1
° 5 2 . 4 1
1/5 1000 0 0 0 1
3 0 0 5
Inner Wall 600
400 Outer Outer Wall 50 1200
0 0 2 1
0 0 5
Inner Wall 100 1950
50
5000
Outer Wall 150
14000
Project Title
ABU Asia-Pacific Robot Con test 2004 Seoul "Reunion of Separated Lovers, Gyeonwoo & Jiknyeo " SCALE:
SHEET 2 OF 3
A3
Project Report th 8 Sem. I.C.
3. MACHINES Each team must design and construct either or both handmade Manual Machine and Automatic Machine(s) to compete in the contest. There is no restriction in the number of Automatic Machine(s) but ONLY ONE Manual Machine is allowed to each team. (1) Manual Machine a. Manual Machine has to be operated via remote control using cable connected to the Manual Machine or remote control using infrared rays, visible rays or sound waves. Radio waves are not allowed. Operators are not allowed to ride on the machines. b. When operating via cable, the connecting point between the Machine and the control box must be placed at least 1000 mm above the ground. Also the length of the cable from the Manual Machine to the control box must not exceed 3000 mm. c. The team members are not allowed to operate the machines or touch
Project Report th 8 Sem. I.C.
3. MACHINES Each team must design and construct either or both handmade Manual Machine and Automatic Machine(s) to compete in the contest. There is no restriction in the number of Automatic Machine(s) but ONLY ONE Manual Machine is allowed to each team. (1) Manual Machine a. Manual Machine has to be operated via remote control using cable connected to the Manual Machine or remote control using infrared rays, visible rays or sound waves. Radio waves are not allowed. Operators are not allowed to ride on the machines. b. When operating via cable, the connecting point between the Machine and the control box must be placed at least 1000 mm above the ground. Also the length of the cable from the Manual Machine to the control box must not exceed 3000 mm. c. The team members are not allowed to operate the machines or touch the materials placed on the game field by using cable. d. Manual Machine or its operator cannot touch “Gyeonwoo Zone (Zone A)’s floor and extend over into “Jiknyeo Zone (Zone B)”. e. Manual Machine cannot touch the boundary lines or extend over the opponent’s “Milky Way Zone”. f. Manual Machine cannot touch its own team’s Automatic Machines. g. Manual Machine is allowed to send a signal to an Automatic Machine only once for communication. (2) Automatic Machine(s) a. Automatic Machines have to be autonomous. b. Everything separated from an automatic machine is considered to be another automatic machine, so it must work as an automatic machine. c. Automatic Machines are allowed to go into any zones except for the opponent’s “Gyeonwoo Zone (Zone A)”. d. There is no no time restriction restriction for the start of Automatic Machines. Machines. In other words, each Automatic Machine can be started at a different time after a game begins. e. Once a machine starts, the team members are not allowed to touch the machine. But, after a team calls for a “retry” and the referee grants it, Nirma Institute of Technology
Project Report th 8 Sem. I.C.
all the team are allowed to reset and restart any Automatic Machines from the start zone. f. “Retry” is permitted only once per game for each team. (3) Method of Control a. Only one operator for each team is allowed to control Manual Machine in the game field. b. The Automatic Machine operators are allowed to enter the game field only when they start the machines including a “retry”. c. Each Automatic Machine must be started by one operation. (4) Power Supply a. Each team shall prepare its own power source for all its machines during the games. b. Voltage of the machines’ electrical power source must be below DC24 V. c. Power source that is considered dangerous or unsuitable by the committee shall not be permitted. (5) Weight a. The total sum of weight of all machines must not exceed 50 kg. b. The total weight includes the weight of power sources, cables, remote controller and other parts of the machines. (6) Size a. The total size of Automatic Machines has to fit in the size of 1200 mm x 1200 mm x 1500 mm at the Start Zone. b. After the game begins, Automatic Machines can be separated and the sizes can be changed freely. c. The Manual Machine has to fit in the size of 1200 mm x 1200 mm x 1500 mm at the Start Zone. d. After the game begins, the size of Manual Machine can be changed freely, but it cannot be separated.
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Project Report th 8 Sem. I.C.
Apart from the mentioned technical details in the report there are other numerous facts like scoring methodology, limitations of the robots, violations in the game, decision of winner etc. that could matter during each game to be played for 3 minutes. The details pertaining to the same could be obtained from the following sources. ü
QUESTIONS REGARDING THEME AND RULES
Questions regarding theme and rules should be addressed by e-mail to the Committee in English. E-mail:
[email protected] [email protected]
‘ABU Robocon 2004 Seoul’ http://www.abu.org.my/programm http://www.ab u.org.my/programme/robocon/robocon e/robocon/robocon.htm .htm http://www.kbs.co.kr/aburobocon2004
The Contest Rules designed by KBS Technical Advisor Group Prof. Chong Nam Chu, Seoul National University Prof. Dong Sam Park, University of Incheon Dr. Young Soo Lee, Seoul National University Mr. Min Soo Park, Seoul National University & ABU Contest Committee
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
SECTION 2 PROJECT OBJECTIVES:
As the title of the project along with the game theme suggests there are in total four robots planned to be placed into the game field in order to complete the required task. For the proper execution of the strategy for the game the robots are require to work in coordination and thus the robots are made capable to communicate amongst themselves as well.
The four robots could be classified into two categories as mentioned below:
1. Semi-autonomous (Manual) Robot
-
1
2. Autonomous Robots
-
3
Semi-autonomous (Manual) Robot – Viswakarma: The manual robot is actually the semi-autonomous robot mentioned in the title which is controlled using a control box attached to the system through cables. There are various controls in the robot and the electronic system is designed to work in full manual mode or semi-autonomous manual mode.
Various features of the manual robot are mentioned here: ü
Locomotion Module using Parallel H-Bridge Drive
ü
Scissor Mechanism for Single or Half Bridge Part Gripping
ü
Lead screw Mechanism for Gripping of two stacked Bridge Parts
ü
Hoist Mechanism for Gripped Bridge Parts
ü
Flap Mechanism for Reference and Bridge Completion
ü
Signaling Mechanism for Intra robot Communication
ü
Feedback Mechanisms using Limit Switches
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
Autonomous Robots: There are three fully autonomous robots planned to operate in the automatic machine zone. These three autonomous robots and their features are mentioned here:
Kuber – The Golden Gift Career:
This autonomous robot is designed to grip the Golden Gift placed at the center of the automatic zone and carry it over the bridge to the Jiknyeo’s hands and accomplish the reunion.
Various features of the robot are:
ü
Line Following and Turning
ü
Rotary Switch Feedback in Sweeper Mechanism
ü
Vacuum Gripper Mechanism
ü
Serial Interface for Program Modification
ü
Status Monitoring Module using Serial Interface and LCD
Natraj – The Point Scoring Robot:
This autonomous robot is designed to gather one after another 11 gifts from various places in the automatic zone into its helical structure and finally deploy the gifts into the 1 point scoring bin and 2 point scoring bin in order to score points.
Various features of the robot are:
ü
Line Following and Turning
ü
Rotary Switch Feedback Mechanism in the Rotating Center Shaft
ü
Gift Intake and Gift Delivery Mechanism
Nirma Institute of Technology
Project Report th 8 Sem. I.C. ü
Serial Interface for Program Modification
ü
Status Monitoring Module using Serial Interface and LCD
Ganesh – The Multipurpose Robot:
This autonomous robot is designed to be a multipurpose robot which could be used as a test platform for testing of various programs as well as it could also be used to perform tasks like gift pick n place and for defense against the attack from opponent’s automatic robots.
Various features of the robot are:
ü
Line Following and Turning
ü
Mechanism for Defense
ü
Serial Interface for Program Modification
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
SECTION 3 Function Description:
Various functions of the Semi-autonomous robot are described in the following part of the section.
Locomotion Module Using Parallel H-Bridge Drive:
This is a very specific feature incorporated in the manual robot due to the high current requirement of the motors. The Swiss make Faulhaber Motors used for the locomotion module of the manual robot require high current of above 3 A per motor where the limitation of the H-Bridge IC LMD18200 comes into picture. This IC could withstand the maximum current of 3 A. Thus two such ICs have been paralleled in order to provide the sufficient drive current to one motor without damaging the IC or the circuitry. In this case the control signals and the supply signals to the IC are the same and their outputs are connected so that the motors are supplied sufficient current for full high speed drive.
Scissor Mechanism for Single or Half Bridge Part Gripping:
As per the game theme a total of six bridge parts are required by both the teams for the completion of the bridge of both the teams but the available full bridge parts are only five. Thus one of the team might have to use two half bridge parts for the completion of the bridge gap.
Scissor Mechanism is specially designed for the same. It is capable to grip a single bridge part or two half bridge parts individually. This mechanism is controlled using rack n pinion motors used for the automatic door locks of the cars.
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Project Report th 8 Sem. I.C.
Lead screw Mechanism for Gripping of two stacked Bridge Parts:
The stacks of two bridge parts at the extremes of the manual machine common zone would be used to fill up the remaining two gaps of the bridge. These two bridge parts would be gripped using a gripper with lead screw mechanism that uses high torque geared motors to rotate the lead screw and grip the stacked bridge parts.
Hoist Mechanism for Gripped Bridge Parts:
For hoisting the gripped single or half bridge parts thread and pulley are used where the thread is attached with the high torque geared motor that pulls the thread and the scissor mechanisms are hoisted along with the bridge part or parts.
Flap Mechanism for Reference and Bridge Completion:
The rotating flaps connected to the slow speed motors are provided on the rear side of the robot in order to have the reference from the wall so that the bridge parts are gripped at their centers of gravity as well as while the bridge parts are filled into the bridge gaps they could be filled properly.
Signaling Mechanism for Intra robot Communication
The manual robot equipped with a signaling device so that when it completes the bridge, it could signal the automatic robots to continue their tasks further. For the same the a laser signaling device is mounted onto the robot which while signaling covers a specific range of angle in order to send the signal to the automatic robot.
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
Feedback Mechanisms using Limit Switches
As mentioned the manual robot is planned to be semi-autonomous as well. For the same purpose there are various limit switches mounted onto the robot at various places which shall detect the positions of the moving parts of the robots such as hoist mechanism, flaps etc. The on and off signals from the switches going to the microcontroller shall automatically decide the next operation of the robot. In this case the manual controller shall not have to control anything apart from the drive of the robot.
Various features of the autonomous robots are further discussed in the following part of the section.
Line Following and Turning
The autonomous robots are required to perform their respective tasks without any manual guidance. Thus the technique used to make the robots reach the desired locations in order to perform their tasks is the white line following, cross detection and turning technique using the optoelectronic sensors.
These optoelectronic sensors are actually developed during the project using light to voltage converter IC – OPT101 and LED. These sensors work on the principle of reflective light amplification. The IC – OPT101 comprised of a photodiode and amplifier. The light of LED reflects from the surface and falls on to the OPT101 which is amplified by the amplifier inbuilt the IC. The intensity of the light falling onto the photodiode of IC depends upon the color of the surface. Thus while the sensor is on the white line it gives the saturated output voltage where as while not on the white line it gives a low voltage. This voltage is converted into a digital signal using an analog comparator IC TLC393
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
where the second input to the IC is a fixed voltage. Thus when the output voltage of the sensor is below certain level i.e. when the sensor is not on white line it gives ‘0’ as the output whereas if the output voltage of the sensor is above certain level i.e. when the sensor is on the white line it gives ‘1’ as the output.
Using six such sensors divided into two rows on in front and one at the rear side the white line following is achieved. To make the robot follow the white line various sequences of the possible states of the sensors are considered and depending upon the same, position of the robot and correction required in the proper direction is analyzed. Finally on the basis of the required correction, PWM signal is applied to the H-Bridge drive circuit which uses LMD18200T IC, and the straight line is followed by the robot. For the motion of the robot high torque Maxon Motors are used with the gearbox having 1:18 ratio of gear reduction.
While the robot follows the white line it is also required for the robot to take 90 degree turn in certain direction. For the same the cross detection is used in which the robot counts the number of crosses in the grid it passes and when this number matches with the number of cross where it has to turn or stop, the robot stops the straight line motion and the by rotating both the motors in the opposite directions it takes the turn in the desired direction till the desired sensor in the front line of the sensors come onto the white line.
Rotary Switch Feedback Mechanism
This is a very special feature introduced in the robots in order to reduce the weight and complexity involved in implementing the stepper motors. This mechanism is used wherever a part of the robot is desired to be rotated only till certain position is achieved or only by certain angle.
In this mechanism the shaft of a 12 position rotary switch is coupled with the rotating member of the robot so that the rotary switch also turns by the angle the rotating
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Project Report th 8 Sem. I.C.
member of the robot rotates. During the same process the position of the rotary switch is read by the microcontroller and as per the program whenever the rotating element of the robot reaches the desired position the pertaining position of the rotary switch is read and the motor is stopped immediately.
Vacuum Gripper Mechanism
Vacuum Gripper is a unique feature incorporated in the golden gift carrying autonomous robot. In this mechanism a vacuum gripper is used to pick up the golden gift and this vacuum gripper is actuated using a lead screw mechanism. The prerequisite for generating vacuum and gripping the gift is that the gripper tool should be in contact with the surface to be gripped with sufficient pressure and to generate the same another lead screw mechanism is used which brings the gripping surface of the gripper tool and the surface of the gift to be gripped in contact with each other with sufficient pressure required to generate vacuum and grip the gift.
Serial Interface for Program Modification and Status Monitoring
Serial Interface between the Microcontroller and the Computer is established in order to update the microcontroller program as well as to monitor the status of various sensors and switches etc. on the robot. This serial communication between the microcontroller and the computer is done using the trial version of the Procomm Software.
Serial communication allows the operator to monitor the status of various parts of the robot especially sensors, limit switches etc. and accordingly verify the functioning of the robot and its electronic circuitry. This also allows the operators to update the microcontroller program very fast without detaching it from the circuit as the time between the two games shall be very less and the program might be required to be changed as per the change in the strategy for the game.
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Status Monitoring using LCD
For the status monitoring purpose apart from the serial interface LCD also is used. When the computer is not available nearby the testing area of the robot to monitor the status of various sensors and limit switches mounted on the robots, LCD interface is used.
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Project Report th 8 Sem. I.C.
SECTION 4
HARDWARE & SOFTWARE
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SOFTWARE
The software programs for the microcontroller have been developed using Assembly Level Programming language. Microcontroller used in the project is DS89C420 manufactured by Dallas Semiconductor which is 8052 based microcontroller. Thus for microcontroller software programming Evaluation Version of Assembler – 8051IDE developed by AceBus has been used to assemble, compile and simulate the software programs.
The benefit of using DS89C420 microcontroller is that it has a 16kb of Flash Memory for programs, 1kb of RAM and 256 bytes of SRAM and also for loading the program into the microcontroller flash memory self developed serial programmer could be used and the programming is fast due to flash memory. For loading the program from the computer to the microcontroller through serial programmer the MTK – Microcontroller Tool Kit developed by Dallas Semiconductors has been used.
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LCD Interface
The LCD interface has been developed in order to monitor the status of various components, sensors, switches on the robot as well as for microcontroller operation. The test software for the 16x2 Matrix Intelligent LCD interface with microcontroller is shown here.
;CONTROL LINES RS EQU P1.0 RW EQU P1.1 EN EQU P1.2 ;DATA PORT --> P3 ORG 0000 START: MOV SP,#80H LCALL PORTCONFIG LCALL READY MOV A,#'R' LCALL DISP MOV A,#'O' LCALL DISP MOV A,#'B' LCALL DISP MOV A,#'O' LCALL DISP MOV A,#'C' LCALL DISP MOV A,#'O' LCALL DISP MOV A,#'N'
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LCALL DISP MOV A,#' ' LCALL DISP MOV A,#'2' LCALL DISP MOV A,#'0' LCALL DISP MOV A,#'0' LCALL DISP MOV A,#'4' LCALL DISP MOV A,#0C0H LCALL CMND MOV A,#'N' LCALL DISP MOV A,#'I' LCALL DISP MOV A,#'T' LCALL DISP PORTCONFIG: MOV P1,#00H MOV P3,#00H RET
;Configure required Ports as Input or Output
READY: ;Initialize LCD to be Ready to operate CLR RS CLR RW LCALL CHK MOV A,#80H LCALL CMND MOV A,#01H LCALL CMND MOV A,#03H LCALL CMND MOV A,#3CH LCALL CMND MOV A,#3CH LCALL CMND MOV A,#0FH LCALL CMND MOV A,#06H LCALL CMND SETB RW SETB RS RET CMND: ;Send the Command LCALL CHK MOV P3,#00H MOV P3,A
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CLR RS CLR RW SETB EN CLR EN RET DISP: ;Display Character LCALL CHK MOV P3,#00H MOV P3,A SETB RS CLR RW SETB EN CLR EN RET CHK: ;Check the Busy Flag CLR RS SETB RW MOV P3,#0FFH CNT: CLR EN SETB EN JB P3.7,CNT CLR EN MOV P3,#00H RET END
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Project Report th 8 Sem. I.C.
Serial Interface The Serial Interface is found easier and more suitable for status monitoring as it could also be used for program modification. Thus compared to LCD Serial Interface is much more used for program p rogram modification and status monitoring purpose.
MSG HHH
DECODE1 H
DECODE2 H
DECODE3 H
PWx
PAGE
WRITE
NEW PAGE
PRH
PAGE
READ
DON'T CARE
XAx
XRAM
LOB WRITE ADDR
DATA
RXA
READ
XRAM
LOB OF ADDRESS
SAx
SRAM
LOB WRITE ADDR
DATA
RSA
READ
SRAM
LOB OF ADDRESS
ANY OTHER MESSAGE
SAMPLE COMMUNICATION: HHH THOR COMMUNICATIONS. LINK OK HOI COMMAND SYNTAX ERROR. TRY AGAIN PW2 PRF Xa99 Sb88 RXa9 RSb8 HHH THOR COMMUNICATIONS. LINK OK HYU COMMAND SYNTAX ERROR. TRY AGAIN
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RESPONSE 'THOR COMMUNICATIONS. LINK OK.' SET PAGESEL=NEW ADDR SEND CONTENTS OF PAGESEL WRITE x TO PAGESEL+W. SEND CONTENTS OF PAGESEL+x WRITE X TO SRAM LOCATION A SEND CONTENTS OF SRAM LOCATION A 'COMMAND SYNTAX ERROR. TRY AGAIN'
Project Report th 8 Sem. I.C.
Program ;DOCUMENTATION ;REGISTERS IN USE: ;R0 FOR COUNTING AND TRANSFERRING DATA ;T1 FOR TIMING THE 9600BPS COUNT ;ADDITIONAL ADDRESSES: ;CRITICAL ADDRESSES: ;#0160H, #0161H, #0162H FOR STORING COMMAND BEFORE PROCESSING ;#0163H, #0164H FOR STORING DPTR FOR ERR AND ACK MESSAGES ;NON-CRITICAL ADDRESSES: ;PAGESEL (41H), TEMP (42H) ;NON-CRITICAL BITS: ;ERR_ON (21H), ACK_ON (22H), P_WR (23H), VBCR (24H), VBLF (25H) ;START ADDRESS: 1000H ;END ADDRESS: 11FDH
;BYTES PAGESEL EQU 41H TEMP
EQU 42H
;BITS ERR_ON EQU 21H ACK_ON EQU 22H P_WR
EQU 23H
VBCR
EQU 24H
VBLF
EQU 25H
ORG 0000H LJMP INIT
ORG 0023H LJMP SER_PROC
ORG 0100H
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Project Report th 8 Sem. I.C.
INIT:
;MASTER INIT ALGOL
MOV SP,#80H
;MASTER INIT DIRECTIVE
;>>> LCALL SI_INIT ;CALL TO MODULE 'SERIAL INTERFACE' ;>>> LJMP LOOPINF
;STANDARD IDLE LOOP
ORG 0120H LOOPINF: NOP SJMP LOOPINF
ORG 1001H MSG:
DB 13,10,'THOR COMMUNICATIONS. LINK OK',13,10
ORG 1031H MSG1: DB 13,10,'COMMAND SYNTAX SYNTAX ERROR. TRY AGAIN',13,10
ORG 1060H SI_INIT:
;MODULE 'SERIAL INTERFACE'
ORL 0C4H, #03H
;ENABLE SRAM, LOCATION C4H BITS 0 AND 1
MOV PAGESEL,#00H CLR ERR_ON CLR ACK_ON CLR VBCR MOV R0, #60H LCALL SER_INIT RET
ORG 1078H SER_INIT: ANL SCON, #00H SETB SCON.6
;SCON.7,6=01 => MODE 1
SETB SCON.4
;SCON.4=REN =>RECEIVER ENABLED
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Project Report th 8 Sem. I.C.
SETB SCON.3
;SCON.3=1 =>STOP BIT =1
MOV TH1, #0FDH ;RELOAD SETTINGS FOR 9600BPS ANL TMOD, #0FH ;CLEAR ALL BITS OF TMOD FOR TIMER1 ORL TMOD, #20H ;SET TIMER1 TO MODE 2 AUTORELOAD SETB TR1
;START TIMER1
ORL IE, #90H
;SET EA=1 AND ES0=1 TO ENABLE GLOBAL AND SERIAL0
INTERRUPTS RET
ORG 1098H SER_PROC: JNB RI, TXINT CLR RI MOV A, SBUF
;LOAD RECEIVED DATA
MOV DPTR, #0160H;SAVE TO #0100H+[R0] MOV DPL, R0 MOVX @DPTR, A ;SAVE TO XRAM INC R0 MOV A, R0 CJNE A, #63H, KR
;SEE IF TOTAL 3 BYTE COMMAND HAS BEEN RECVD
LCALL PROC_CMD ;IF YES PROCESS COMMAND COMMAND KR:
RETI
TXINT: CLR TI
;ELSE OR THEN DO NOTHING ;CLR THE TI INTERRUPT
JNB ERR_ON, TXT1 LCALL ERR_MSG RETI TXT1: JNB ACK_ON, TXT2 LCALL ACK_MSG RETI TXT2: JNB VBCR, TXT3 SETB VBLF CLR VBCR MOV SBUF, #0DH RETI
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Project Report th 8 Sem. I.C.
TXT3: JNB VBLF, TXT4 CLR VBLF MOV SBUF, #0AH RETI TXT4: MOV R0, #60H RETI
ORG 10D8H PROC_CMD: MOV DPTR, #0160H MOVX A, @DPTR CJNE A, #48H, PCM1
;'H'
INC DPTR MOVX A, @DPTR CJNE A, #48H, PCME
;'H'
INC DPTR MOVX A, @DPTR CJNE A, #48H, PCME
;'H'
SETB ACK_ON CLR ERR_ON MOV DPTR, #1001H XRL A, A MOVC A, @A+DPTR MOV SBUF, A LCALL SAV_DPTR RET PCM1: CJNE A, #50H, PCM2
;'P'
INC DPTR MOVX A, @DPTR CJNE A, #57H, PCM1A
;'W'
SETB P_WR LCALL PAGE_OPS RET PCM1A:
CJNE A, #52H, PCME
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;'R'
Project Report th 8 Sem. I.C.
CLR P_WR LCALL PAGE_OPS RET PCM2: CJNE A, #52H, PCM3
;'R'
INC DPTR MOVX A, @DPTR CJNE A, #58H, PCM2A
;'X'
INC DPTR MOVX A, @DPTR MOV DPL, A MOV DPH, PAGESEL MOVX A, @DPTR MOV SBUF, A SETB VBCR RET PCM2A:
CJNE A, #53H, PCME
;'S'
INC DPTR MOVX A, @DPTR MOV R0, A MOV A, @R0 MOV SBUF, A SETB VBCR RET PCM3: CJNE A, #58H, PCM4
;'X' [WRITE XRAM]
INC DPTR MOVX A, @DPTR MOV TEMP, A INC DPTR MOVX A, @DPTR MOV DPL, TEMP MOV DPH, PAGESEL MOVX @DPTR, A MOVX A, @DPTR MOV SBUF, A
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;WRITE TO XRAM
Project Report th 8 Sem. I.C.
SETB VBCR RET PCM4: CJNE A, #53H, PCME
;'S' [WRITE SRAM]
INC DPTR MOVX A, @DPTR MOV R0, A INC DPTR MOVX A, @DPTR MOV @R0, A
;WRITE TO SRAM
MOV A, @R0 MOV SBUF, A SETB VBCR RET PCME: CLR ACK_ON
;COMMAND SYNTAX ERROR SEQUENCE
SETB ERR_ON MOV DPTR, #1031H
;ERR MSG LOCATION IS #1031H
XRL A, A MOVC A, @A+DPTR MOV SBUF, A LCALL SAV_DPTR RET
ORG 1168H PAGE_OPS: JNB P_WR, POP1 INC DPTR
;CHK IF IT IS PWRITE OR PREAD CMD ;HERE IF PWRITE
MOVX A, @DPTR CJNE A, #2FH, POP1A LJMP POE POP1A: JB CY, POP1B
;[A]>#2FH THEN NO BORROW=>PROCESS 30->33H
CJNE A, #34H, POP1C LJMP POE POP1C:
JNB CY, POE CLR CY
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;[A]>#34H THEN NO BORROW=>ERROR
Project Report th 8 Sem. I.C.
SUBB A, #30H
;HERE MEANS 2FH<[A]<34H
LJMP POP1E POP1B: CJNE A, #04H, POP1D LJMP POE POP1D: JNB CY, POE
;[A]>#04H THEN NO BORROW=>ERROR
POP1E: MOV PAGESEL, A POP1: MOV SBUF, PAGESEL SETB VBCR RET POE:
CLR ACK_ON
SETB ERR_ON MOV DPTR, #1031H
;ERR MSG LOCATION IS #1031H
XRL A, A MOVC A, @A+DPTR MOV SBUF, A RET
ORG 11A8H ERR_MSG: LCALL RD_DPTR INC DPL MOV A, DPL CJNE A, #54H, EMX CLR ERR_ON MOV R0, #60H RET EMX:
XRL A, A
MOVC A, @A+DPTR MOV SBUF, A LCALL SAV_DPTR RET
ORG 11C4H ACK_MSG:
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;!!!REQUIRED FOR FOR FUTURE COMM RECEPTION
Project Report th 8 Sem. I.C.
LCALL RD_DPTR INC DPL MOV A, DPL CJNE A, #21H, AMX CLR ACK_ON MOV R0, #60H
;!!!REQUIRED FOR FUTURE COMM RECEPTION
RET AMX:
XRL A, A
MOVC A, @A+DPTR MOV SBUF, A LCALL SAV_DPTR RET
ORG 11E0H SAV_DPTR: MOV TEMP, DPH MOV A, DPL MOV DPTR, #0163H
;DPL IN #0163H AND DPH IN #0164H
MOVX @DPTR, A INC DPTR MOV A, TEMP MOVX @DPTR, A RET
ORG 11F0H RD_DPTR: MOV DPTR, #0163H MOVX A, @DPTR
;RETRIEVE DPL
MOV TEMP, A
;SAVE TO TEMP
INC DPTR MOVX A, @DPTR MOV DPH, A
;RETRIEVE DPH ;LOAD DPH
MOV DPL, TEMP RET
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;LOAD DPL
Project Report th 8 Sem. I.C.
White Line Following
As mentioned earlier in the report, straight line following for the white line has been implemented for the autonomous robots in order to make them reach their desired positions in the grid of automatic zone to perform their respective tasks automatically. The test program for the same is included in the following part of the section. Here only the test program is mentioned but the optimized version of the same with more features in it also has been developed.
Program:
;BIT ALOCATIONS LDIR EQU P1.0 LDRV EQU P1.1 RDIR EQU P1.2 RDRV EQU P1.3 ORG 0000H LJMP START ORG 0100H START: LCALL PORTCONFIG SLF: MOV A,P2 CPL A MOV P3,A MOV A,P2 ANL A,#0FCH MOV R0,A MOV A,R0 CJNE A,#48H,NXT1 LJMP STRGHT NXT1: MOV A,R0 CJNE A,#4CH,NXT2 LJMP RGHT1 NXT2: MOV A,R0 CJNE A,#58H,NXT3 LJMP LEFT1 NXT3: MOV A,R0 CJNE A,#0CCH,NXT4
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
LJMP RGHT2 NXT4: MOV A,R0 CJNE A,#78H,NXT5 LJMP LEFT2 NXT5: MOV A,R0 CJNE A,#8CH,NXT6 LJMP RGHT3 NXT6: MOV A,R0 CJNE A,#38H,NXT7 LJMP LEFT3 NXT7: MOV A,R0 CJNE A,#0D8H,NXT8 LJMP RGHT4 NXT8: MOV A,R0 CJNE A,#98H,NXT9 LJMP RGHT5 NXT9: MOV A,R0 CJNE A,#6CH,NXT10 LJMP LEFT4 NXT10: MOV A,R0 CJNE A,#2CH,NXT11 LJMP LEFT5 NXT11: MOV A,R0 CJNE A,#64H,NXT12 LJMP RGHT6 NXT12: MOV A,R0 CJNE A,#0D0H,NXT13 LJMP LEFT6 NXT13: MOV A,R0 CJNE A,#90H,NXT14 LJMP RGHT4 NXT14: MOV A,R0 CJNE A,#24H,NXT15 LJMP LEFT4 NXT15: MOV A,R0 CJNE A,#80H,NXT16 LJMP LEFT7 NXT16: MOV A,R0 CJNE A,#10H,NXT17 LJMP RGHT8 NXT17: MOV A,R0 CJNE A,#20H,NXT18 LJMP RGHT7 NXT18: MOV A,R0 CJNE A,#04H,NXT19 LJMP LEFT8 NXT19: MOV A,R0 CJNE A,#00H,NXT20 LJMP DEFAULT NXT20: LJMP START
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
PORTCONFIG: MOV P1,#00H MOV P2,#0FFH MOV P3,#0FFH RET
STRGHT: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#40H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT1: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#30H LCALL DLY SETB RDRV CLR LDRV MOV R1,#10H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT1: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#30H LCALL DLY CLR RDRV SETB LDRV MOV R1,#10H LCALL DLY
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT2: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#2BH LCALL DLY SETB RDRV CLR LDRV MOV R1,#15H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT2: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#2BH LCALL DLY CLR RDRV SETB LDRV MOV R1,#15H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT3: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#26H LCALL DLY SETB RDRV
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Project Report th 8 Sem. I.C.
CLR LDRV MOV R1,#1AH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT3: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#26H LCALL DLY CLR RDRV SETB LDRV MOV R1,#1AH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT4: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#3AH LCALL DLY SETB RDRV CLR LDRV MOV R1,#06H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT4: SETB RDIR SETB LDIR SETB RDRV SETB LDRV
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
MOV R1,#3AH LCALL DLY CLR RDRV SETB LDRV MOV R1,#06H LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT5: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#33H LCALL DLY SETB RDRV CLR LDRV MOV R1,#0DH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT5: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#33H LCALL DLY CLR RDRV SETB LDRV MOV R1,#0DH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
RGHT6: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#36H LCALL DLY SETB RDRV CLR LDRV MOV R1,#0AH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
LEFT6: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#36H LCALL DLY CLR RDRV SETB LDRV MOV R1,#0AH LCALL DLY CLR RDRV CLR LDRV MOV R1,#20H LCALL DLY LJMP SLF
RGHT7: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#20H LCALL DLY SETB RDRV CLR LDRV MOV R1,#0DH LCALL DLY CLR RDRV CLR LDRV MOV R1,#33H
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
LCALL DLY LJMP SLF
LEFT7: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#20H LCALL DLY CLR RDRV SETB LDRV MOV R1,#0DH LCALL DLY CLR RDRV CLR LDRV MOV R1,#33H LCALL DLY LJMP SLF
RGHT8: CLR RDIR CLR LDIR SETB RDRV SETB LDRV MOV R1,#23H LCALL DLY SETB RDRV CLR LDRV MOV R1,#0DH LCALL DLY CLR RDRV CLR LDRV MOV R1,#30H LCALL DLY LJMP SLF
LEFT8: CLR RDIR CLR LDIR SETB RDRV SETB LDRV MOV R1,#23H LCALL DLY CLR RDRV SETB LDRV MOV R1,#0DH LCALL DLY
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
CLR RDRV CLR LDRV MOV R1,#30H LCALL DLY LJMP SLF
DEFAULT: SETB RDIR SETB LDIR SETB RDRV SETB LDRV MOV R1,#20H LCALL DLY CLR RDRV CLR LDRV MOV R1,#40H LCALL DLY LJMP SLF
DLY: MOV R2,#0FFH DLYCNT: DJNZ R2,DLYCNT DJNZ R1,DLYCNT
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
HARDWARE The hardware implementation in this project is done in a unique way. As the robots and their design are very complex and the number of inputs and outputs of the system may vary according to the requirements and change in strategy or design the PCBs made for the robots are designed to be multipurpose such that the same circuits and PCBs could be used for all the robots just with minute change and increase or decrease in the number of components mounted on the PCB.
The Schematics of various circuits are included in the following part of this section.
Nirma Institute of Technology
5 J1
+ -
D IO IO DE D4 E
D2
24 V EXT
U3
1 2
1 C3 22uF
D3
D1
7812 7812/T /TO O
V IN IN
U4 3
DV OU OU T N G
1
D
J2
J3
C
J4
B
2
7 80 80 5/ 5/ TO TO
C4 10uF
D4
3
VCC
3
DV OU OU T N G
V IN IN
2
POWER SUPPLY 1
D IO IO DE DE
C5 2.2uF
1
VCC
D5
2
LED RED
LED YELLOW
LED GREEN
R3 22K
R4 10K
R5 5K
L IS IS TE TE NE NE R D R RV V AX AX 1 2 3 4 5 6 7 8 DRVAXL.LS2 9 DRVAXL.LS1 10
SI.RXD SI.TXD VCC
C7 VCC 10nF HB12VT.LS1 HB12VT.LS2 VCC
L IS IS TE TE NE NE R H B1 B1 2V 2V 1 2 3 4 5 6 7 8 HB12VL.LS1 9 10
U1 39 38 37 36 35 34 33 32 DRVAXL.LS2 DRVAXL.LS1 HB12VL.LS1 HMIL.LS1 HMIL.LS2 HMIL.LS3 LCDL.LS1 AUXL.LS1
L IS IS TE TE NE NE R H MI MI 1 2 3 4 5 6 7 8 HMIL.LS1 9 10 HMIL.LS2 11 HMIL.LS3 12 VCC 13
VCC
U2 1 2 3 4 5 6 7 8
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7
P1.0/T2 P1.1/T2X P1.2 P1.3 P1.4 P1.5 P1.6 P1.7
21 22 23 24 25 26 27 28
P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P 2 .7
P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P 3 .7
10 11 12 13 14 15 16 17
19 18
X1 X2
ALE/P PSEN
30 29
31 9
3 4 7 8 13 14 17 18 SI.RXD SI.TXD HB12VT.LS1 HB12VT.LS2 DRVAUXT.LS1 DRVAUXT.LS2 LCDT.LS1 LCDT.LS2
VCC
11 1
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
J8 1 2 3 4 5 6 7 8 9 10 11 12
T AL AL KE KE R H B1 B1 2V 2V
D
C
LE OE
J 10 10 1 2 3 4 5 6 7 8 DRVAUXT.LS1 9 DRVAUXT.LS2 10 VCC 11 12
74LS373
EA/VP RST
T AL AL KE KE R A UX UX
B
DS89C420
C6 10uF VCC R2 10K
A
T AL AL KE KE R D RV RV AX AX
2 5 6 9 12 15 16 19
14
J5
J7 1 2 3 4 5 6 7 8 9 10 11 12
LIS TE TE NE NER LC D 1 2 3 4 5 6 7 8 LCDL.LS1 9 10 VCC
J6 1 2 3 4 5 6 7 8 9 10
AUXL.LS1 VCC
R1 100E
L IS IS TE TE NE NE R A UX UX
LCDT.LS1 LCDT.LS2 VCC
PB
DESIGNER'S NOTES: D1 OF LISTENER
5
T AL AL KE KE R L CD CD
LCD/AUX IS USED
A
FOR READING LCD BUSY FLAG. THE
Title
REST CAN BE USED
C1 30pF
TO READ 7 OTHER INPUTS
11.0592 Mhz Y1
C2 30pF
VISHWAKARMA MICROCONTROLLER CARD S ize A4
Document Number VK .1
D ate:
5
J9 1 2 3 4 5 6 7 8 9 10 11 12
Tuesday, April 06, 2004
Rev 1.1 S heet
1
4
3
2
1
4
3
2
1
of
1
D1 VCC LED GREEN
R3 5K1
D
D U1
J1 INTERFACE BUTTONS LANDER
C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
MASTERON.TOGGLE AUTOMODE.EN.TOGGLE SPG1.PUSHBUTTON SPG2.PUSHBUTTON FLAP.TOGGLE DPG1.TOGGLE DPG2.TOGGLE GG.PSHLOCKBUTTON GAH.ON.TOGGLE GAH.DR.TOGGLE SPH.ON.TOGGLE SPH.DR.TOGGLE DPH.ON.TOGGLE DPH.DR.TOGGLE SPEEDCONTROL.SLIDER1 SPEEDCONTROL.SLIDER2 DIRNCONTROL.FWD.PB DIRNCONTROL.REV.PB DIRNCONTROL.RGT.PB DIRNCONTROL.LFT.PB SIGNAL.PUSHBUTTON
R2 VCC
10K
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
HMIT.LS1 J2 TALKER
74LS373 U2 3 4 7 8 13 14 17 18 VCC
11
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
LE
OE
2 5 6 9 12 15 16 19 1
HMIT.LS1 HMIT.LS2 HMIT.LS3
HMIT.LS2
74LS373
VCC
U3 3 4 7 8 13 14 17 18
B VCC J3 POWER OUT 1 2 3 4 5 6 7 8 9 10
2 2 3
VCC
11
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
LE
OE
1 2 3 4 5 6 7 8 9 10 11 12 13 14
MASTER ON IS INPUT ON 1ST 74LS373'S D0 23 OTHER INPUTS CAN BE THEN READ INTO THE MICROCONTROLLER USING THE 3 SELECTION LINES
2 5 6 9 12 15 16 19 1
C
B
HMIT.LS3
74LS373
0 4 5 6 7 8 9 1
R1 RESISTOR SIP 10 [10K]
1
A
A Title VISHWAKARMA HUMAN MACHINE INTERFACE CARD S ize A4 D ate:
5
4
3
2
Document Number VK .4 Tuesday, April 06, 2004
Rev 1.1 S heet
1
1
of
1
5
4
3
2
1
D1 VCC LED GREEN
R3 5K1
D
D U1
J1 INTERFACE BUTTONS LANDER MASTERON.TOGGLE AUTOMODE.EN.TOGGLE SPG1.PUSHBUTTON SPG2.PUSHBUTTON FLAP.TOGGLE DPG1.TOGGLE DPG2.TOGGLE GG.PSHLOCKBUTTON GAH.ON.TOGGLE GAH.DR.TOGGLE SPH.ON.TOGGLE SPH.DR.TOGGLE DPH.ON.TOGGLE DPH.DR.TOGGLE SPEEDCONTROL.SLIDER1 SPEEDCONTROL.SLIDER2 DIRNCONTROL.FWD.PB DIRNCONTROL.REV.PB DIRNCONTROL.RGT.PB DIRNCONTROL.LFT.PB SIGNAL.PUSHBUTTON
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
C
R2 VCC
10K
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
HMIT.LS1 J2 TALKER
U2 3 4 7 8 13 14 17 18 11
VCC
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
LE
OE
2 5 6 9 12 15 16 19
HMIT.LS1 HMIT.LS2 HMIT.LS3
HMIT.LS2
1
1 2 3 4 5 6 7 8 9 10 11 12 13 14
74LS373
VCC
U3 3 4 7 8 13 14 17 18
B
11
VCC 2 2 3
J3 POWER OUT
MASTER ON IS INPUT ON 1ST 74LS373'S D0
74LS373
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
LE
OE
2 5 6 9 12 15 16 19
B
HMIT.LS3
1
C
74LS373
0 4 5 6 7 8 9 1
VCC
D0 D1 D2 D3 D4 D5 D6 D7
23 OTHER INPUTS CAN BE THEN READ INTO THE MICROCONTROLLER USING THE 3 SELECTION LINES
R1 RESISTOR SIP 10 [10K]
1 2 3 4 5 6 7 8 9 10
1
A
A Title VISHWAKARMA HUMAN MACHINE INTERFACE CARD S ize A4
Document Number VK .4
D ate:
5
4
3
5 DESIGNER NOTES:
4
3
Q4 IS INVERTED O/P OF Q5 [MASTER ON] RM.DR RM.ON
J1
3 5
U14A 1 1 2
D
3
24V
2
D2 LED
POWER HEADER
4
RM.DR
Tuesday, April 06, 2004
S heet
2
6
2
DIR PWM
BS1
1
BRAKE
BS2 D N G
74LS08
C17 1000uF
8 9
RM.M1 C1
CS OUT TH OUT
LM.DR 3 LM.ON 5
10nF 10nF
11
4
C2
1
LMD18200T
C C V
OUT1
2
DIR PWM
BS1
1
BRAKE
BS2 D N G
RM.M2
10
OUT2
6
U7
OUT1
of
1
24V
LMD18200T
C C V
CS OUT TH OUT
1
1
2
24V
U3 8 9
Rev 1.1
7
OUT2
LM.M1 C8 10nF 10nF
11 C7
D
LM.M2
10
7
U14B 4
R2 22K
6 5
J2 RM.ON RM.M1 RM.M2 LM.M1 LM.M2
74LS08 24V
LAYOUT CAUTION NOTES:
8
POWER HEADER , AUX MOTORS HEADER AND DRV MOTORS HEADER SHOULD BE RATED TO CARRY 10A [MAX]
10
DRV MOTORS LM.DR
74LS08
U14D 12 11 13
6
U6 8 9 RM.DR RM.ON
CHECK FOR CONNECTIONS OF 74LS08 AND 74LS373 TO 5V AND NOT TO 24V
LM.ON
CS OUT TH OUT
LMD18200T
C C V
DIR PWM
BS1
4
BRAKE
BS2
11
OUT2
10
D N G
74LS08
C3
CS OUT TH OUT
LM.DR 3 LM.ON 5
10nF 10nF
4
C4
LMD18200T
C C V
OUT1
LM.M1
2 C5
1
DIR PWM
BS1
BRAKE
BS2
11
OUT2
10
D N G
RM.M2
10nF 10nF C6 LM.M2
C
VCC 1 2 3 4 5 6 7 8 9 10 11 12
DRVAXL.LS1 DRVAXL.LS2
DRVAXL.LS1
VCC
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
11 1
LE OE
2 5 6 9 12 15 16 19
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
R.DR R.ON L.DR L.ON MASTER.IND MASTER.ON R.BR L.BR
D1 LED
7
R1
7
10K
24V
J4 LISTENER
DOUBLE PART HOIST [DPH]
U1 U11
DRVAXL.LS2
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
11 1
LE OE
R3
B 1
8 9
SPH.DR SPH.ON DPH.DR DPH.ON GAH.DR GAH.ON GG.DR GG.ON
1
MASTER.ON
2
DPH.ON
0 8 9 1
VCC
11
LMD18200T OUT1 BS1
BRAKE
BS2 D N G
U13B 6
OUT2
U5 8 9
SPH.M1
2
DPH.DR
1 C9 11
10nF 10nF
3 5 4
C10
CS OUT TH OUT
C C V
D0 D1 D2 D3 D4 D5 D6 D7 LE
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
OUT1 BS1 BS2
D N G
OUT2
DPH.M1
2 1 C11 11
10nF 10nF C12 DPH.M2
10
7
OE
SPH.LOW SPH.HGH DPH.LOW DPH.HGH GAH.LOW GAH.HGH GG.OL GG.CL
3 4 7 8 13 14 17 18
24V
SPH.M1 SPH.M2 DPH.M1 DPH.M2 GAH.M1 GAH.M2 GG.M1 GG.M2
0 6 7 8 9 1
VCC
11
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
LE
OE
GIFT GRIPPER [GG]
2 5 6 9 12 15 16 19 1
1 2 3 4 5 6 7 8 DRVAXT.LS2 9 DRVAXT.LS1 10
3 5
DIR PWM
BS1
BRAKE
BS2
74LS373 R4 RESISTOR SIP 10
4
10
C C V
D N G
74LS08
LMD18200T
CS OUT TH OUT
U13C 8
6
8 9
1
9
24V
GIFT ARM HOIST [GAH]
U2
GAH.ON
D0 D1 D2 D3 D4 D5 D6 D7
OUT1
OUT2
U4 GAH.M1
2
GG.DR
1 C13 11 10
10nF 10nF
6
CS OUT TH OUT
3 5
DIR PWM
BS1
BRAKE
BS2
C C V
D N G
GAH.M2
LMD18200T
8 9
4
C14
7
OUT1
OUT2
1 2 3 4 5 6 7 8
AUX MOTORS GG.M1
2 1 C15 11
10nF 10nF C16
10
GG.M2
7
A
U13D
J5 TALKER
MASTER.ON
12
GG.ON
13
11
Title VISHWAKARMA DRIVE CONTROL & AUXILIARY MOTOR CARD
74LS08
Size A3 Date:
4
B
J3
2 5 6 9 12 15 16 19
MASTER.ON
5
LMD18200T
BRAKE
SPH.M2
10
6
DIR PWM
7
5
74LS373
1
C C V
DIR PWM
4
GAH.DR
VCC
VCC
6
U9 3 4 7 8 13 14 17 18
2 3 4 5
CS OUT TH OUT
74LS08
RG1 RG2
J6 MSW LANDER
3
3 5
74LS08
U12 1 2 3 4 5 6 7 8 9 10 11 12
SPH.DR
4
MASTER.ON
2 3 4 5 6 7
U13A
SPH.ON
74LS373
RESISTOR SIP 10
J7 AUX MSW LANDER 1 2 3 4 5 6 7 8 9 10 11 12
2 5 6 9 12 15 16 19
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
24V
SINGLE PART HOIST [SPH]
74LS373
A
1
8 9
RM.M1
2
OUT1
6
U8
3 5
U10
C
24V
U14C 9
1 2 3 4
3
2
Document Number VK.2 Tuesday, April 06, 2004
Rev 1.0 Sheet
1
1
of
1
5 DESIGNER NOTES:
4
3
Q4 IS INVERTED O/P OF Q5 [MASTER ON] RM.DR RM.ON
J1
3 5
U14A 1 1 2
D
3
24V
2
D2 LED
POWER HEADER
6
U3 8 9
4
RM.DR
2
24V
LMD18200T
C C V
CS OUT TH OUT DIR PWM
BS1
BRAKE
BS2 D N G
74LS08
C17 1000uF
6
U7 8 9
RM.M1
2
OUT1
C1
1
4
C2
BS1
BRAKE
BS2 D N G
7
LM.M1
2
OUT1
DIR PWM
RM.M2
10
OUT2
LMD18200T
C C V
CS OUT TH OUT
LM.DR 3 LM.ON 5
10nF 10nF
11
1
24V
C8
1
10nF 10nF
11 C7
D
LM.M2
10
OUT2
7
U14B 4
R2 22K
6 5
J2 RM.ON RM.M1 RM.M2 LM.M1 LM.M2
74LS08 24V
LAYOUT CAUTION NOTES:
8
POWER HEADER , AUX MOTORS HEADER AND DRV MOTORS HEADER SHOULD BE RATED TO CARRY 10A [MAX]
10
DRV MOTORS LM.DR
74LS08
U14D 12 11 13
6
U6 8 9 RM.DR RM.ON
CHECK FOR CONNECTIONS OF 74LS08 AND 74LS373 TO 5V AND NOT TO 24V
LM.ON
CS OUT TH OUT
LMD18200T
C C V
DIR PWM
BS1
BRAKE
BS2
11
OUT2
10
D N G
8 9
RM.M1
2
OUT1
4
74LS08
6
U8
3 5
U10
C
24V
U14C 9
1 2 3 4
C3
1
10nF 10nF
C C V
CS OUT TH OUT
LM.DR 3 LM.ON 5 4
C4
LMD18200T LM.M1
2
OUT1
C5
1
DIR PWM
BS1
BRAKE
BS2
11
OUT2
10
D N G
RM.M2
10nF 10nF C6 LM.M2
C
VCC 1 2 3 4 5 6 7 8 9 10 11 12
3 4 7 8 13 14 17 18
DRVAXL.LS1 DRVAXL.LS2
DRVAXL.LS1
D0 D1 D2 D3 D4 D5 D6 D7
11 1
VCC
2 5 6 9 12 15 16 19
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
R.DR R.ON L.DR L.ON MASTER.IND MASTER.ON R.BR L.BR
D1 LED
7
R1
7
10K
LE OE
24V
J4 LISTENER
DOUBLE PART HOIST [DPH]
DRVAXL.LS2
D0 D1 D2 D3 D4 D5 D6 D7
11 1
LE OE
R3
B J7 AUX MSW LANDER
8 9
SPH.DR SPH.ON DPH.DR DPH.ON GAH.DR GAH.ON GG.DR GG.ON
U13A
SPH.ON
1
MASTER.ON
2
2 3 4 5 6 7
0 8 9 1
4 74LS08
11
VCC
BS1
BRAKE
BS2 D N G
U13B
DPH.ON
4 6
DPH.DR
1 C9 11
10nF 10nF
3 5
DIR PWM
BS1
BRAKE
BS2
C C V
OUT1
D N G
SPH.M2
10
OUT2
CS OUT TH OUT
4
C10
LMD18200T
8 9
7
5
D0 D1 D2 D3 D4 D5 D6 D7 LE
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
OUT2
DPH.M1
2 1 C11 11
10nF 10nF C12 DPH.M2
10
7
OE
24V
SPH.M1 SPH.M2 DPH.M1 DPH.M2 GAH.M1 GAH.M2 GG.M1 GG.M2
GAH.DR
U12 3 4 7 8 13 14 17 18
0 6 7 8 9 1
11
VCC VCC
[GG]
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
LE
OE
1
1 2 3 4 5 6 7 8 DRVAXT.LS2 9 DRVAXT.LS1 10
LMD18200T
CS OUT TH OUT
3 5
DIR PWM
BS1
BRAKE
BS2
U13C 4
C C V
10
OUT1
D N G
74LS08
OUT2
6
U4 GAH.M1
2
GG.DR
1 C13 11
10nF 10nF
CS OUT TH OUT
3 5
DIR PWM
BS1
BRAKE
BS2
4
C14
C C V
OUT1
D N G
GAH.M2
10
LMD18200T
8 9
7
OUT2
AUX MOTORS GG.M1
2 1 C15 11
10nF 10nF C16 GG.M2
10
7
A
MASTER.ON
12
GG.ON
13
11
Title VISHWAKARMA DRIVE CONTROL & AUXILIARY MOTOR CARD
74LS08
Size A3
Document Number VK.2
Date:
5
1 2 3 4 5 6 7 8
U13D
J5 TALKER
R4 RESISTOR SIP 10
6
8 9
8
GAH.ON
D0 D1 D2 D3 D4 D5 D6 D7
74LS373 1
GIFT GRIPPER
1
9
24V
GIFT ARM HOIST [GAH]
U2
74LS373
SPH.LOW SPH.HGH DPH.LOW DPH.HGH GAH.LOW GAH.HGH GG.OL GG.CL
B
J3
2 5 6 9 12 15 16 19
MASTER.ON
J6 MSW LANDER
DIR PWM
6
U5 SPH.M1
2
OUT1
U9 3 4 7 8 13 14 17 18
2 3 4 5
3 5
LMD18200T
C C V
CS OUT TH OUT
74LS08
VCC
1 2 3 4 5 6 7 8 9 10 11 12
SPH.DR 3
74LS373
RG1 RG2
1 2 3 4 5 6 7 8 9 10 11 12
2 5 6 9 12 15 16 19
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
MASTER.ON
RESISTOR SIP 10
1
A
6
U1 U11 3 4 7 8 13 14 17 18
24V
SINGLE PART HOIST [SPH]
74LS373
4
3
5
4
Rev 1.0
Tuesday, April 06, 2004
Sheet
2
3
1
of
1
1
2
1
J3
D
2 2 3 4 5
VCC
R4
VCC
VCC
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
HB12VT.LS1 HB12VT.LS1
74LS373
C
1
G1.STL G2.STL
0 6 7 8 9 1
VCC
J2 MSW LANDER
U10
F1.1 F1.2 F2.1 F2.2 G1.OL G2.OL
F1.1 F1.2 F2.1 F2.2 G1.OL G2.OL SG1.OL SG2.OL
1 2 3 4 5 6 7 8 9 10 11 12
RESISTOR SIP 10 [10K]
VCC
U12 3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
G1.DR G1.ON G2.DR G2.ON MASTER.IND MASTER.ON LSR.DRV LSR.EN
R1 R
C6
12V
10uF
5K1
F1
U1 D2 LED F1.DR F1.ON
8 9
CS OUT TH OUT
3 5
DIR PWM
4
6 C C V
R2 R
LMD18200T OUT1 2 BS1
BRAKE
74LS373
BS2
D N G
OUT2
3
+
2
-
G1.STL
1
F1.M1
10uF LED
G1 U7
10nF 10nF
G1.DR G1.ON F1.M2
10
VCC VCC
7
R6 R
C1
R7 R
5
+
6
-
8 9
CS OUT TH OUT
3 5
DIR PWM
4
BRAKE
6 C C V
LMD18200T OUT1 2
D N G
G1.M1
BS1
1 C17
BS2
11 C18
OUT2
10nF 10nF G1.M2
10
7
R8 R
U14B 12V
C8
12V D4
TLC393
1 C9
11 C10
D
TALKER
R3 R
U14A
R9
1 2 3 4 5 6 7 8 9 10
G2.STL
7 D3 TLC393
C4
12V
10uF F2 U2
C
8 9 J4
3 5
U11 1 2 3 4 5 6 7 8 9 10 11 12
HB12VL.LS1 HB12VL.LS2
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
VCC
F1.DR F1.ON F2.DR F2.ON SG2.DR SG2.ON SG1.DR SG1.ON
F2.DR F2.ON
4
CS OUT TH OUT
LED
6 C C V
LMD18200T OUT1 2 BS1
1 C11
BS2
11 C12
BRAKE
D N G
OUT2
G2 U3
F2.M1
10nF
DIR PWM
G2.DR G2.ON
10nF
8 9
CS OUT TH OUT
3 5
DIR PWM
6 C C V
4
BRAKE
D N G
C5
12V
1 C19
BS2
11 C20
OUT2
10nF 10nF G2.M2
10
U5 12V EXT SG2.ON
B
8 9
CS OUT TH OUT
3 5
DIR PWM
6 C C V
LMD18200T OUT1 2
K1 4
4 3
BRAKE
5 8
C26
12V
10uF SG11 U8
10uF SG21
D N G
BS1
1 C13
BS2
11 C14
OUT2
8 9
SG21.M1
6 C C V
10uF
DIR PWM
4
BRAKE
LSR U9
LMD18200T OUT1 2 BS1
3 5 10nF 10nF
CS OUT TH OUT
BS2
D N G
OUT2
SG11.M1
1 C21
VCC
10nF 11 C22
LSR.DRV
8 9
CS OUT TH OUT
3 5
DIR PWM
4
BRAKE
6 C C V
LMD18200T OUT1 2 1 C27
BS2
11 C28
10nF SG11.M2
10
D N G
LSR.M1
BS1
OUT2
10nF 10nF
SG21.M2
10
7
7
R10 VCC
U13B
1 2
D5 DIODE
4
RELAY DPDT 2N2222
LSR.EN
C2
12V
SG12 U4
10uF SG22
U13A
U6
1 3
SG2.DR 2 74LS86 J1 12V EXT
LED
DESIGNER NOTES:
8 9
CS OUT TH OUT
3 5
DIR PWM
4
Q4 IS INVERTED O/P OF Q5 [MASTER ON] [U12]
D1
10E Q2 2N2222
10uF
74LS86
Q1
C3
12V
6
SG1.DR 5
B
LSR.M2
10
7
6 7
12V POWER
BS1
C7
12V
1 2
G2.M1
7
74LS373
12V
LMD18200T OUT1 2
F2.M2
10
7
LISTENER
12V EXT
C
10uF
6 C C V
LMD18200T OUT1 2 BS1
BRAKE
D N G
BS2 OUT2
SG22.M1
1 C15
SG1.ON
8 9
CS OUT TH OUT
3 5
DIR PWM
4
BRAKE
10nF 11 C16
10nF
10
SG22.M2
6 C C V
D N G
J6 MOTORS OUT
LMD18200T OUT1 2 BS1
1 C23
BS2
11 C24
OUT2
G1.M1 G1.M2 G2.M1 G2.M2 LSR.M1 LSR.M2 LSR.AN LSR.CT F1.M1 F1.M2 F2.M1 F2.M2 SG11.M1 SG11.M2 SG21.M1 SG21.M2 SG12.M1 SG12.M2 SG22.M1 SG22.M2
SG12.M1
10nF
10
10nF SG12.M2
7
7
C25 100uF
LAYOUT CAUTION NOTES: 1.) RELAY [K1] SHOULD BE 5AMP/CONTACT TYPE 2.) THE 12V POWER HEADER [J1] SHOULD BE ABLE TO SOURCE 10AMP [MAX VALUE] 3.) MOTORS OUT HEADER [J6] SHOULD BE ABLE TO SUPPLY 1A/PIN [MAX VALUE] 4.) ALL BYPASS CAPACITORS SHOULD BE AS CLOSE TO THEIR RESPECTIVE LMD18200s AS POSSIBLE. 5.) ALL ELECTROLYTIC CAPS ARE RATED AT 16/25V
A
R5 22K
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
A
Title VISHWAKARMA 12V H-BRIDGE BOARD Size A3 Date: 5
4
3
2
Document Number VK.3
Rev 1.1
Wednesday, April 14, 2004
Sheet 1
1
of
1
5
4
3
2
1
J3
D
U10
F1.1 F1.2 F2.1 F2.2 G1.OL G2.OL
F1.1 F1.2 F2.1 F2.2 G1.OL G2.OL SG1.OL SG2.OL
1 2 3 4 5 6 7 8 9 10 11 12
2 2 3 4 5
VCC
R4
VCC
VCC
U12
11
LE
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
OE
1
G1.DR G1.ON G2.DR G2.ON MASTER.IND MASTER.ON LSR.DRV LSR.EN
R1 R
C6
12V
D0 D1 D2 D3 D4 D5 D6 D7
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
1 2 3 4 5 6 7 8 9 10
HB12VT.LS1 HB12VT.LS1
74LS373
RESISTOR SIP 10 [10K]
3 4 7 8 13 14 17 18
VCC
VCC
C
1
J2 MSW LANDER
G1.STL G2.STL
0 6 7 8 9 1
3 4 7 8 13 14 17 18
R9 10uF
5K1
F1
6
U1 D2 LED F1.DR F1.ON
8 9
CS OUT TH OUT
3 5
DIR PWM
C C V
R2 R
LMD18200T OUT1 2 BS1
4
BRAKE
74LS373
BS2
D N G
OUT2
3
+
2
-
G1.STL
1
C8
12V D4
TLC393 F1.M1
10uF LED
G1 U7
1 C9 10nF 11 C10
10nF
G1.DR G1.ON F1.M2
10
VCC VCC
7
R6 R
R7 R
5
+
6
-
6
8 9
CS OUT TH OUT
3 5
DIR PWM
4
BRAKE
C C V
LMD18200T OUT1 2
D N G
G1.M1
BS1
1 C17
BS2
11 C18
10nF 10nF G1.M2
10
OUT2
7
R8 R
U14B C1
12V
D
TALKER
R3 R
U14A
G2.STL
7 D3 TLC393
C4
12V
10uF F2 U2
C
J4 U11 1 2 3 4 5 6 7 8 9 10 11 12
HB12VL.LS1 HB12VL.LS2
3 4 7 8 13 14 17 18
D0 D1 D2 D3 D4 D5 D6 D7
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
2 5 6 9 12 15 16 19
11
LE
OE
1
VCC
F1.DR F1.ON F2.DR F2.ON SG2.DR SG2.ON SG1.DR SG1.ON
F2.DR F2.ON
8 9
CS OUT TH OUT
3 5
DIR PWM
4
LED
6
BRAKE
C C V
LMD18200T OUT1 2
D N G
G2 U3
F2.M1
BS1
1 C11
BS2
11 C12
OUT2
10nF G2.DR G2.ON
10nF
6
8 9
CS OUT TH OUT
3 5
DIR PWM
C C V
4
D N G
BRAKE
G2.M1
BS1
1 C19
BS2
11 C20
10nF 10nF G2.M2
10
OUT2
7
74LS373
C5
12V
10uF SG11 U8
10uF SG21 U5
12V EXT SG2.ON
B
8 9
CS OUT TH OUT
3 5
DIR PWM
6 C C V
LMD18200T OUT1 2 BS1
K1 4
4
BRAKE
3 5 8
C26
12V
C7
12V
12V
LMD18200T OUT1 2
F2.M2
10
7
LISTENER
12V EXT
C
10uF
BS2
D N G
OUT2
8 9
SG21.M1
1 C13
CS OUT TH OUT
11 C14
C C V
3 5
DIR PWM
4
BRAKE
LSR U9
LMD18200T OUT1 2 BS1
10nF 10nF
6
10uF
BS2
D N G
OUT2
SG11.M1
1 C21
VCC
10nF 11 C22
LSR.DRV
6
8 9
CS OUT TH OUT
3 5
DIR PWM
4
BRAKE
C C V
LMD18200T OUT1 2 1 C27
BS2
11 C28
10nF
10nF SG11.M2
10
D N G
LSR.M1
BS1
10nF
SG21.M2
10
7
7
R10
7
6
VCC
U13B
7 1 2
4
D5 DIODE
RELAY DPDT 2N2222
C2
12V
10uF SG12 U4
10uF SG22
U13A
U6
1 3
SG2.DR 2 74LS86 J1
DESIGNER NOTES:
12V EXT 1 2
LED
12V POWER
8 9
CS OUT TH OUT
3 5
DIR PWM
4
Q4 IS INVERTED O/P OF Q5 [MASTER ON] [U12]
D1
10E Q2 2N2222
LSR.EN
74LS86
Q1
C3
12V
6
SG1.DR 5
B
LSR.M2
10
OUT2
6 C C V
LMD18200T OUT1 2 BS1
BRAKE
D N G
BS2 OUT2
8 9
SG22.M1
1 C15
SG1.ON
DIR PWM
4
BRAKE
10nF 11 C16
10nF SG22.M2
10
CS OUT TH OUT
3 5
6 C C V
J6 MOTORS OUT
LMD18200T OUT1 2
D N G
BS1
1 C23
BS2
11 C24
OUT2
G1.M1 G1.M2 G2.M1 G2.M2 LSR.M1 LSR.M2 LSR.AN LSR.CT F1.M1 F1.M2 F2.M1 F2.M2 SG11.M1 SG11.M2 SG21.M1 SG21.M2 SG12.M1 SG12.M2 SG22.M1 SG22.M2
SG12.M1
10nF
10
10nF SG12.M2
7
7
C25 100uF
LAYOUT CAUTION NOTES: 1.) RELAY [K1] SHOULD BE 5AMP/CONTACT TYPE 2.) THE 12V POWER HEADER [J1] SHOULD BE ABLE TO SOURCE 10AMP [MAX VALUE] 3.) MOTORS OUT HEADER [J6] SHOULD BE ABLE TO SUPPLY 1A/PIN [MAX VALUE] 4.) ALL BYPASS CAPACITORS SHOULD BE AS CLOSE TO THEIR RESPECTIVE LMD18200s AS POSSIBLE. 5.) ALL ELECTROLYTIC CAPS ARE RATED AT 16/25V
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SECTION 5 Heuristics Design and Development: This whole project in itself has been a mammoth task to complete within a short time of five months during which the A to Z of the project was supposed to be designed and developed physically in reliable and working conditions. Due to the same reason a lot of research oriented activity, new ideas and heuristics designing has been done in order to minimize efforts, time and at the same time gain more efficiency. In the same process implementation of certain concepts mentioned below have played and important role in
ü
Optoelectronic Sensor using OPT101 and LED
ü
Multipurpose Schematics and PCB Designs
Sheet 1
Project Report th 8 Sem. I.C.
the formation of this project.
Rev
Monday,May10, 2004
1
of
1
Project Report th 8 Sem. I.C.
SECTION 5 Heuristics Design and Development: This whole project in itself has been a mammoth task to complete within a short time of five months during which the A to Z of the project was supposed to be designed and developed physically in reliable and working conditions. Due to the same reason a lot of research oriented activity, new ideas and heuristics designing has been done in order to minimize efforts, time and at the same time gain more efficiency. In the same process implementation of certain concepts mentioned below have played and important role in the formation of this project.
ü
Optoelectronic Sensor using OPT101 and LED
ü
Multipurpose Schematics and PCB Designs
ü
Serial Interface for Status Monitoring and Program Updating
ü
LCD interface for Status Monitoring
Optoelectronic Sensor using OPT101 and LED
Using the combination of PDIP IC – OPT101 and LED with the concept of reflective light amplification as the Optoelectronic sensor has been a totally new development at student level. This development has been specially beneficial as the weight constituted by the sensors is much lesser then the commercially available ready made sensors and also if the sensor fails it is very easy to change the IC or even the whole set up to make the system working again.
Nirma Institute of Technology
Project Report th 8 Sem. I.C.
Multipurpose Schematics and PCB Designs
The Schematics and PCB Designs of the Electronic Circuits have been done such that the PCBs are multipurpose and just with the minute change in the number of components mounted on the PCB and some change in the interconnections between the PCBs, they could be used for all the robots. In fact the PCBs are made such that in most of the general robotic applications these PCBs could be used.
The robotic systems are MIMO – Multi Input Multi Output Systems and the Set of PCBs is made so flexible that it could be used for sensing 64 Inputs as well as for sending 48 output signals.
Serial Interface for Status Monitoring and Program Updating
Loading the microcontroller again and again with minute changes in the program is always a time taking process especially while testing the programs. At the same time when the program is not performing as per the desire it is necessary to find the flaw in the program which is possible by monitoring various RAM locations, Registers, Microcontroller Ports, and Individual Bits etc. on the microcontroller.
Implementing Serial Interface is the solution to both these problems as the program in the microcontroller could be quickly updated using Serial Interface and at the same time monitoring status of various memory locations and ports etc. become easy using the serial communication.
LCD interface for Status Monitoring
Monitoring status is difficult where the serial communication between PC and microcontroller is not easy as the PC is not nearby. In this case the LCD is interfaced with the microcontroller in order to monitor the status and debug the program.
Nirma Institute of Technology
Ultra-High-Speed Flash Microcontroller User’s Guide
33
16kB FLASH MEMORY
1kB SRAM 25
DUAL DATA POINTERS WITH AUTOSELECT INCREMENT/ DECREMENT
HIGH-SPEED ONE CLOCK-CYCLE 8051 MICROPROCESSOR
FOUR 8-BIT PARALLEL PORTS
S P I M
5 1
DUAL SERIAL PORTS
0 ORIGINAL 8051
DS89C420
DS89C420
SECTION 1: INTRODUCTION Dallas Semiconductor’s Semiconductor’s DS89C420 is an 8051-compatible microcontroller that provides improved performance and power consumption when compared to the original 8051 version. It retains instruction set and object code compatibility with the 8051, yet performs the same operations in fewer clock cycles. Consequently, greater throughput is possible for the same crystal speed. As an alternative, the DS89C420 can be run at a reduced frequency to save power. The more efficient design allows a much slower crystal speed to get the same results as an original 8051, using much less power. The fundamental innovation of the DS89C420 is the use of only one clock per instruction cycle compared with 12 for the original 8051. This results in up to 12 times improvement in performance over the original 8051 architecture and up to four times improvement over other Dallas Semiconductor high-speed microcontrollers. The DS89C420 provides several peripherals and features in addition to all of the standard features of an 80C32. These include 16kB of on-chip on-ch ip flash memory, 1kB of on-chip RAM, four 8bit I/O ports, three 16-bit timer/counters, two on-chip UARTs, dual data pointers, an on-chip watchdog timer, five levels of interrupt
priority, and a crystal multiplier. The device provides 256 bytes of RAM for variables and stack; 128 bytes can be reached using direct or indirect addressing, or using indirect addressing only. only. In addition to improved efficiency, the DS89C420 can operate at a maximum clock rate of 33MHz. Combined with the 12 times performance, this allows for a maximum performance of 33 million instructions per second (MIPs). This level of computing power is comparable to many 16-bit processors, but without the added expense and complexity if implementing a 16-bit interface. The DS89C420 incorporates a power-management mode that allows the device to dynamically vary the internal clock speed from 1 clock per cycle (default) to 1024 clocks per cycle. Because power consumption is directly proportional to clock speed, the device can reduce its operating frequency during periods of little switchback. This greatly reduces power consumption. The switchback feature allows the device to quickly return to highest speed operation upon receipt of an interrupt or serial port activity, allowing the device to respond to external events while in power-management mode.
___________________________________ ________________ ______________________________________ _____________________________________ __________________ Maxim Integrated Products 1
Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide DS89C420 Special-Function Register Locations REGISTER P0
ADDRESS 80h
SP DPL DPH DPL1 DPH1 DPS PCON TCON TMOD TL0 TL1 TH0 TH1 CKCON P1 EXIF CKMOD SCON0 SBUF0 ACON P2 IE SADDR0 SADDR1
81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 90h 91h 96h 98h 99h 9Dh A0h A8h A9h AAh
P3 IP1 IP0 SADEN0 SADEN1 SCON1 SBUF1 ROMSIZE PMR STATUS TA T2CON T2MOD RCAP2L RCAP2H TL2 TH2 PSW FCNTL FDATA WDCON ACC EIE B EIP1 EIP0
B0h B1h B8h B9h BAh C0h C1h C2h C4h C5h C7h C8h C9h CAh CBh CCh CDh D0h D5h D6h D8h E0h E8h F0h F1h F8h
BIT 7 P0.7
BIT 6 P0.6
BIT 5 P0.5
BI T 4 P0.4
BIT 3 P0.3
BIT 2 P0.2
BIT 1 P0.1
BIT 0 P0.0
ID1 SMOD_0 TF1 GATE
ID0 SMOD0 TR1 C/ T
TSL OFDF TF0 M1
AID OFDE TR0 M0
— GF1 IE1 GATE
— GF0 IT1 C/ T
— STOP IE0 M1
SEL IDLE IT0 M0
WD1 P1.7 IE5
WD0 P1.6 IE4
T0M P1.3 CKRY T0MH TB8_0
MD1 P1.1 RGSL
MD0 P1.0 B GS
SM1_0
T1M P1.4 IE2 T1MH REN_0
MD2 P1.2 RGMD
SM0/FE_0
T2M P1.5 IE3 T2MH SM2_0
RB8_0
TI_0
RI_0
PAGEE P2.7 EA
PAGES1 P2.6 ES1
PAGES0 P2.5 ET2
P2.4 ES0
P2.3 ET1
P2.2 EX1
P2.1 ET0
P2.0 EX0
P3.7 — —
P3.6 MPS1 LPS1
P3.5 MPT2 LPT2
P3.4 MPS0 LPS0
P3.3 MPT1 LPT1
P3.2 MPX1 LPX1
P3.1 MPT0 LPT0
P3.0 MPX0 LPX0
SM0/FE_1
SM1_1
SM2_1
REN_1
TB8_1
RB8_1
TI_1
RI_1
CD1 PIS2
CD0 PIS1
SWB PIS0
CTM —
PRAME 4X/ 2X 2X SPTA1
RMS2 ALEON SPRA1
RMS1 DME1 SPTA0
RMS0 DME0 SPRA0
TF2 —
EXF2 —
RCLK —
TCLK —
EXEN2 —
TR2 —
C/ T2 T2OE
CP/ RL2 RL2 DCEN
CY FBUSY
AC FERR
F0
RS1
RS0 FC3
OV FC2
F1 FC1
P FC0
SMOD_1
POR
EPFI
PFI
WDIF
WTRF
EWT
RWT
—
—
—
EWDI
EX5
EX4
EX3
EX2
—
—
—
MPWDI LPWDI
MPX5 LPX5
MPX4 LPX4
MPX3 LPX3
MPX2 LPX2
Note: Shaded bits are timed-access protected.
___________________________________ _____________________________________________________ _____________________________________ _____________________________________ _____________________ ___
10
Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide ROM Size Select (ROMSIZE) SFR C2h
7 — R-1
6 — R-1
5 — R-1
4 — R-1
3 PRAME RT-0
2 RMS2 RT-1
1 RMS1 RT-0
0 RMS0 RT-1
R = Unrestricted read, W = Unrestricted write, T = Timed-access writ e only, -n = Value after reset
LPX0 Bit 0
Least Significant Priority Select Bit for External Interrupt 0. MPX0 is the least significant bit of the bit pair MPX0 (IP1.0), LPX0 that designates priority level for external interrupt 0.
Bits 7–3
These bits are reserved. Read data is 1.
PRAME Bit 3
Program RAM Enable. When set (= 1), the internal 1k RAM is mapped as internal program space between addresses 0400h–07FFh. All program fetches and MOVC accesses are directed to this 1k RAM. When serving as program memory, the RAM continues to be accessible as MOVX data space (if DME0 = 1). The 1k RAM is not accessible as program space when EA = 0. When clear (= 0), the internal 1k RAM is not accessible as program space.
RMS2–0 Bits 2–0
ROM Memory Size Select 2-0. This register is used to select the maximum on-chip decoded address. Care must be taken that the memory location of the current program counter is valid both before and after modification. These bits can only be modified using a timed-access procedure. The EA pin overrides the function of these bits when asserted, forcing the device to access external program memory only. only. Configuring this register to a setting that exceeds the maximum amount of internal memory can corrupt device operation. These bits default on reset to the maximum amount of internal program memory (i.e., 16k for DS89C420).
On-Chip ROM Address RS2 0 0 0 0 1 1 1 1
R S1 0 0 1 1 0 0 1 1
RS0 0 1 0 1 0 1 0 1
MAXIMUM ON-CHIP ROM ADDRESS 0kB/Disable on-chip ROM 1kB/03FFh 2kB/07FFh 4kB/0FFFh 8kB/1FFFh 16kB/3FFFh (default) 32kB/7FFFh 64kB/FFFFh
Power Management Register (PMR) SFR C4h
7 CD1 RW*-1
6 CD0 RW*-0
5 SWB RW-0
4 CTM RW*-0
3 4X / 2X RW*-0
2 ALEON RW-0
1 DME1 RW-0
0 DME0 RW-0
R = Unrestricted read, W = Unrestricted write, -n = Value after reset, * = See description
CD1, CD0 Bits 7, 6
Clock Divide Control 1-0. These bits select the number of crystal oscillator clocks required to generate one machine cycle. Switching between modes requires a transition through the default divide-by-1 mode (CD1, CD0 = 10b). Attempts to perform an invalid transition are ignored. For example, going from the crystal multiplier 2X mode to the divide-by-1024 mode would require first switching from the 2X cr ystal multiplier mode to the divide-by-1 mode, followed by the switch from the divide-by-1 to the divide-by-1024 mode. These bits cannot be modified when running from the internal ring oscillator (RGMD = 1). The divide-by-1024 setting (CD1,CD0 = 11b) cannot be selected when switchback is enabled (SWB = 1) and a switchback source (serial port or external interrupt) is active. CD1, CD0 00 01 10 11
CLOCK FUNCTION Crystal multiplier (4X or 2X mode as determined by PMR.3) Rese Reserv rved ed (fo (forc rced ed int into o divi divide de-b -byy-1 1 mode mode ifif set) set) Divi Divide de-b -byy-1 1 (def (defau ault lt stat state) e) Divide-by-1024
The setting of these bits affects timer and serial port operation. Tables located in the SFR decription for CKCON (8Eh) detail the respective operational dependencies on these bits. ___________________________________ _____________________________________________________ _____________________________________ _____________________________________ _____________________ ___
Ultra-High-Speed Flash Microcontroller User’s Guide
28
Ultra-High-Speed Flash Microcontroller User’s Guide UHSM
UHSM
8051
8051
UHSM vs.
HEX
CLOCK
TIME
CLOCK
TIME
8051 SPEED
CODE
CYCLES
@ 25MHz
CYCLES
@ 25MHz
ADVANTAGE
CJNE A, #data, rel
B4
4
160 ns
24
960 ns
6
CJNE Rn, #data, rel
B8..BF
4
160 ns
24
960 ns
6
INSTRUCTION
CJNE @Ri, #data, rel
B6..B7
5
200 ns
24
960 ns
4.8
DJNZ Rn, rel
D8..DF
4
160 ns
24
960 ns
6
DJNZ direct, rel
D5
5
200 ns
24
960 ns
4.8
NOP
00
1
40 ns
12
480 ns
12
Table 5-2. INSTRUCTION SPEED SUMMARY INSTRUCTION CATEGORY
SPEED ADVANTAGE
QUANTITY
4.0 4.8 5.3 6.0 8.0 12.0 24.0 4.0 6.0 8.0 12.0 4.8 6.0 8.0 8.5
2 1 1 12 5 27 1 1 27 5 13 3 5 8 111
SPEED ADVANTAGE
QUANTITY
4.0 4.8 5.3 6.0 8.0 12.0 24.0 4.0 6.0 8.0 12.0 4.8 6.0 8.0 9.4
4 1 1 35 5 93 1 1 42 5 43 4 12 8 255
Total instructions: 1 byte
Total instructions: 2 byte
Total instructions: 3 byte
Average across all instructions OPCODE CATEGORY Total opcodes: 1 byte
Total opcodes: two byte
Total opcodes: three byte
Average across all opcodes
SECTION 6: MEMORY ACCESS The DS89C420 ultra-high-speed microcontroller supports the memory interface convention established for the industry standard 80C51, but also implements two new page mode memory interfaces needed to support ultra-high-speed external operation. These external page mode interfaces are described later in this section. 53
___________________________________ ______________________________________________________ ______________________________________ _____________________________________ ____________________ __
Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide Program and data memory areas can be implemented on-chip, off-chip, or as a combination. When opting not to use the internal memory provided, or when exceeding the maximum maximum address of on-chip program or data memory memory,, the device performs an external memory access using the expanded memory bus on ports 0 and 2. While serving as a memory bus, port 0 and port 2 cannot function as I/O ports. The PSEN signal is driven active low to function as a chip enable or output enable when performing external code memory fetches. The RD and WR signals serve as enables when accessing external SRAM data memory. Program execution always begins at the reset vector, address 0000h. If on-chip program memory is enabled, program execution begins at internal location 0000h; otherwise, external program memory is used. Any reset causes the next program fetch to begin at this location. Subsequent branches and interrupts determine how program memory fetches deviate from sequential addressing.
INTERNAL INTERNAL FLASH MEMORY MEMORY The DS89C420 ultra-high-speed microcontroller contains five physically distinct blocks of embedded flash memory. The two largest blocks, each 8kB, provide a total of 16kB for use as internal program memory. A 64-byte flash security block has been incorporated to allow encryption during program memory verify operations. To To further protect internal code against undesirable access, a three-level lock system has been implemented in a separate flash memory block. This single-byte block contains three lock bits (LB1, LB2, LB3), each of which can individually enable higher lock levels and greater code protection. The fifth flash memory block resident to the DS89C420 is the option control register. This byte contains a bit to enable or disable the watchdog timer reset function (EWT = WDCON.1) on a power-on reset. The two 8kB program memory blocks form a contiguous 16kB address range extending from 0000h through 3FFFh. The on-chip decoded address range is controlled in hardware by the EA pin, and in software through the ROMSIZE feature. The EA pin enables or disables the ability to access internal program memory and overrides any software configured bit settings. The logic state of the EA pin should be changed only when the microcontroller is being held in reset. The EA pin is sampled on each exit from the reset state to determine whether program fetching should begin internally or externally. externally. When the EA pin is low, all code fetches are done externally through the expanded bus. When the EA pin is high, code fetches begin from internal program memory. Code fetches exceeding the maximum address of on-chip program memory cause the device to access off-chip program memory. The maximum on-chip decoded address is selectable by software using the ROMSIZE feature.
ROMSIZE FEATURE Using the ROMSIZE feature, software software can allow the DS89C420 to behave like a device with less on-chip memory. memory. The maximum memory size is dynamically variable. Thus, a portion of memory can be removed from the memory map to access off-chip memory, then restored to access on-chip memory. In fact, all of the on-chip memory can be removed from the memory map, allowing the full 64kB of external memory space to be addressed. The ROMSIZE feature has two primary uses. In the first instance, it allows the device to act as a bootstrap loader for a flash memory or nonvolatile SRAM (NVSRAM). The internal program memory can contain a bootstrap loader, loader, which can program the external memory device. Secondly, this method can be used to increase the amount of available program memory from 64kB to 80kB without bank switching. The maximum amount of on-chip memory is selected by configuring the ROM size select register bits RMS2, RMS1, RMS0 (ROMSIZE.2-0). The reset default condition gives access to the maximum on-chip program memory of 16kB. In this configuration, only code addresses greater than 16kB result in external program memory accesses. The possible settings for the ROM size select register are shown in the following table.
Table 6-1. ROMSIZE REGISTER SETTINGS RMS2 0 0 0 0 1 1 1 1
RMS1 0 0 1 1 0 0 1 1
RMS0 0 1 0 1 0 1 0 1
MAX ON-CHIP PROGRAM MEMORY 0kB 1kB (0-03FFh) 2kB (0-07FFh) 4kB (0-0FFFh) 8kB (0-1FFFh) 16kB (0-3FFFh) DEFAULT INVALID – RESERVED INVALID – RESERVED
Modification of the ROMSIZE (C2h) special function register requires using the timed access procedure and must be followed by a two machine cycle delay, such as executing two NOP instructions, before jumping to the new address range. Interrupts must be disabled during this operation, because a call to an interrupt vector during the changing of the memory map can cause erratic results. To To select ___________________________________ _____________________________________________________ _____________________________________ _____________________________________ _____________________ ___
54
Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide the watchdog reset function automatically automatically.. Other bits of this register are undefined and are at logic 1 when read. The value of this register can be read at address FCh in parallel programming mode or by executing the verify option control register instruction in ROM Loader or in-application programming mode.
FFFF
FFFF
Note: The hatched areas shown on the internal and external memory are disabled on power-up (Default)
INTERNAL MEMORY 03FF
INTERNAL REGISTERS
SCRATCH PAD
128 Bytes SFR
0000
External Data Memory
4000
8kB x 8 Flash Memory (Program)
128 Bytes Indirect Addressing 2000
80 7F
1FFF
8kB x 8 Flash Memory (Program)
Bit Addressable
Bank 3 Bank 2 Bank 1
00
External Program Memory
Data OR prog mem addr from 400–7FF
3FFF
FF
2F 20 1F
1kB x 8 SRAM
Bank 0
0000
03FF
0000
0000
Non-usable if Internal SRAM is activated
Figure 6-1. Memory Map
INTERNAL INTERNAL SRAM MEMORY MEMORY The DS89C420 ultra-high-speed microcontroller incorporates an internal 1kB SRAM that is usable as data, program, or merged program/data memory. Upon a power-on reset, the internal 1kB memory is disabled and transparent to both program and data memory maps. When used for data, the memory is addressed through MOVX commands, and is in addition to the 256 bytes of scratchpad memory. memory. To enable the 1kB SRAM as internal data memory, software must set the DME0 bit (PMR.0). After setting this bit, all MOVX accesses within the first 1kB (0000h–03FFh) is directed to the internal SRAM. Any data memory accesses outside of this range are still directed to the expanded bus. One advantage of using the internal data memory is that MOVX operations automatically default to the fastest access possible. Note that the DME0 bit is cleared after any reset, so access to the internal data memory is prohibited until this bit is modified. The contents of the internal data memory are not affected by the changing of the data memory enable (DME0) bit. Table Table 63 shows how the DME1, DME0 bits affect the data memory map. ___________________________________ _____________________________________________________ _____________________________________ _____________________________________ _____________________ ___
56
Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide When serving as an I/O port, the drive varies as follows: for logic 0, the port invokes a strong pulldown; for logic 1, the port invokes a strong pullup for two oscillator cycles to assist with the logic transition. Then the port reverts to a weak pullup. This weak pullup is maintained until the port transitions from logic 1 to logic 0. External circuits can overdrive the weak pullup. This allows the logic 1 output state to serve as the input state as well. Substantial DC current is available in both the high and low levels. However, the power dissipation limitations make it inadvisable to heavily load multiple pins. In general, sink and source currents should not exceed 10mA total per port (8 bits) and 25mA total per package.
Input Functions The input state of the I/O ports is the same as that of the output logic 1. That is, the pin is pulled weakly to logic 1. This logic 1 state is easily overcome by external components. Thus, after software software writes a 1 to the port pin, the port is configured for input. When the port is read by software, the state of the pin is read. The only exception is the read-modify-write read-modify-write instructions, discussed earlier. earlier. If the external circuit is driving logic 1, then the pin is logic 1. If the external circuit is driving logic 0, then it overcomes the internal pullup. Thus, the pin is the same as the driven logic state. Note that the port latch is not altered by a read operation. Therefore, if logic 0 is driven onto a port pin from an external source, then removed, the pin reverts to the weak pullup, as determined by the internal latch.
SECTION 11: PROGRAMMABLE TIMERS The ultra-high-speed microcontroller incorporates three 16-bit programmable timers and has a watchdog timer with a programmable interval. Because the watchdog timer is significantly different from the other timers, it is described separately. The 16-bit timers are referred to as timers. The three timers offer the same controls and I/O functions that were available in the 80C32. As mentioned, the actual timing of these functions is user selectable to be compatible with the instruction cycle of the older generation of 8051 family (12 clocks per tick) or the new generation (1 clock per tick). The timing for each of the three timers can be selected independently and can be changed dynamically. In most modes, the timers can be used as either counters of external events or timers. When functioning as a counter, 1 to 0 transitions on a por t pin are monitored and counted. When functioning as timers, they effectively count oscillator or system clock cycles. The time base for the timer function is detailed later in this section. Because an input clock pulse must be sampled high for two system clock cycles and low for two system clock cycles in order to be recognized, this sets the maximum sampling frequency on any timer input at one-fourth of the main system clock frequency. frequency. Since the ultra-high-speed microcontroller timers have a variety of features, the following lists summarize the capabilities: Timer 0
Timer 1
Timer 2
13-bit timer/counter
13-bit timer/counter
16-bit timer/counter
16-bit timer/counter
16-bit timer/counter
16-bit timer with capture
8-bit timer w/ autoreload
8-bit timer w/ autoreload 1
6-bit autoreload timer/counter
Two 8-bit timer/counters
External control pulse timer/counter
16-bit up/down autoreload
External control pulse timer/counter
Baud-rate generator
Timer/counter Baud-rate generator Timer output clock generator
16-BIT TIMERS Timers 0 and 1 are nearly identical. Timer 2 has several additional features such as up/down counting, capture values, and an optional output pin that make it unique. The following table summarizes the SFR bits that control operation of timers 0, 1, and 2. Detailed bit descriptions can be found in Section 4. After the table, timers 0 and 1 are described first, followed by a separate description for timer 2. As mentioned above, the time base for each timer can be varied, which is discussed in more detail in the following pages.
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Ultra-High-Speed Flash Microcontroller User’s Guide
96
Ultra-High-Speed Flash Microcontroller User’s Guide Table 11-1. Programmable Timers
0 R E M I T
BIT NAMES GATE C/T M1, M0 TF0 TR0 T0M T0MH
DESCRIPTION Gate control enable for INTO pin Counter/timer select Timer mode select bits Timer overflow flag Timer run control Input clock select (/4) Input clock high-speed select (/1) Timer LSB Timer MSB
REGISTER LOCATION TMOD – 89h TMOD – 89h TMOD – 89h TCON – 88h TCON – 88h CKCON – 8Eh CKMOD – 96h TL0 – 8Ah TH0 – 8Ch
BIT POSITIONS TMOD.3 TMOD.2 TMOD.1,0 TCON.5 TCON.4 CKCON.3 CKMOD.3
GATE C/T M1, M0 TF1 TR1 T1M T1MH
Gate control enable for INT1 pin Counter/timer select Timer mode select bits Timer overflow flag Timer run control Input clock select (/4) Input clock high-speed select (/1) Timer LSB Timer MSB
TMOD – 89h TMOD – 89h TMOD – 89h TCON – 88h TCON – 88h CKCON – 8Eh CKMOD – 96h TL1 – 8Bh TH1 – 8Dh
TMOD.7 TMOD.6 TMOD.5,4 TCON.7 TCON.6 CKCON.4 CKMOD.4
TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/RL2 T2OE DCEN T2M T2MH
Timer overflow flag Timer external flag Timer 2 receive serial clock enable Timer 2 transmit serial clock enable External enable for T2EX pin Timer run control Counter/timer select Capture/reload select Output enable for T2 pin Down count enable Input clock select (/4) Input clock high-speed select (/1) Timer LSB Timer MSB Timer capture LSB Timer capture MSB
T2CON – C8h T2CON – C8h T2CON – C8h T2CON – C8h T2CON – C8h T2CON – C8h T2CON – C8h T2CON – C8h T2MOD – C9h T2MOD – C9h CKCON – 8Eh CKMOD – 96h TL2 – CCh TH2 – CDh RCAP2L – CAh RCAP2H – CBh
T2CON.7 T2CON.6 T2CON.5 T2CON.4 T2CON.3 T2CON.2 T2CON.1 T2CON.0 T2MOD.1 T2MOD.0 CKCON.5 CKMOD.5
1 R E M I T
2 R E M I T
TIMER 0, TIMER 1 MODES Timers 0 and 1 both have three common operating modes. They are 13-bit timer/counter, timer/counter, 16-bit timer/counter, and 8-bit timer/counter with autoreload. Timer 0 can additionally be configured to operate as two 8-bit timers. These four modes, controlled by the TMOD register, are detailed in the following pages.
MODE 0 Mode 0 configures either timer 0 or timer 1 for operation as a 13-bit timer/counter. timer/counter. As shown in Figure 11-1, setting TMOD register bits M1, M0 = 00b selects this operating mode for either timer 0 or timer 1. When using timer 0, TL0 uses only bits 0 through 4. These bits serve as the 5 LSbs of the 13-bit timer. timer. TH0 provides the 8 MSbs of the 13-bit timer. Bit 4 of TL0 is used as a ripple out to TH0 bit 0, thereby completely bypassing bits 5 through 7 of TL0. Once the timer is started using the TR0 (TCON.4) timer enable, the timer counts as long as GATE GATE (TMOD.3) is 0 or GATE GATE is 1 and pin INTO is 1. It counts oscillator or system clock cycles if C/ T (TMOD.2) is set to a logic 0 and 1 to 0 transitions on T0 (P3.4) if C/ T is set to a 1. When the 13bit count reaches 1FFFh (all ones), the next count causes it to roll over to 0000h. The TF0 (TCON.5) flag is set and an interrupt occurs if enabled. The upper 3 bits of TL0 are indeterminate.
97
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Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide Table 12-5. Timer 1 Input Clock Frequency TIMER 1 INPUT CLOCK FREQUENCY
PMR REGISTER BITS 4X/ 2X 2X , CD1, CD0
SYSTEM CLOCK MODE Crystal multiply mode 4X
100
T1MH,T1M = 00 OSC / 12
Crystal multiply mode 2X Divide-by-1 (default) Power-management mode (/1024)
000 X01, X10 X11
OSC / 12 OSC / 12 OSC / 3072
T1MH,T1M = 01 OSC / 1
T1MH,T1M = 1X OSC / 0.25
OSC / 2 OSC / 4 OSC / 1024
OSC / 0.5 OSC / 1 OSC / 1024
Using timer 1 in the 8-bit autoreload mode, serial port baud rates for mode 1 or 3 can be calculated using the formula below.
2 Modes 1, 3 baud rate =
SMOD_x ✕
32
Timer 1 input clock frequency (256 - TH1)
Number of serial bits / Number of timer 1 rollovers
Timer 1 rollover frequency
Timer 1 input clock frequency can be found in the previous table, SMOD_x is the logic state of the baud-rate doubler bit for the associated UART, and TH1 is the user assigned timer 1 reload value. Often, users already know what baud rate is desired and only need to calculate the timer reload value. An equation to calculate the timer reload value, TH1, is as follows:
2
SMOD_x
TH1 = 256 -
✕
timer 1 input clock frequency 32 ✕ baud rate
Note that the 8-bit, autoreload mode for timer 1 is the one most commonly used for serial port applications, but that it can actually be configured in any mode, even as a counter.
Using Timer 2 for Baud-Rate Generation To use timer 2 as baud-rate generator for serial por t 0, the timer is configured in autoreload mode. Then, either the TCLK or RCLK bit (or both) are set to a logic 1. TCLK = 1 selects timer 2 as the baud-rate generator for the transmitter and RCLK = 1 selects timer 2 for the receiver. receiver. Thus, serial port 0 can have the transmitter and receiver operating at different baud rates by choosing timer 1 for one data direction and timer 2 for the other. RCLK and TCLK reside in T2CON.4 and TCON.5, respectively. Although the timer 2 input clock can be configured similarly to timer 1, it must be placed into a baud-rate generator mode in order to be used by serial port 0. Setting either RCLK or TCLK to a logic 1 selects timer 2 for baud-rate generation. When this is done, the timer 2 input clock becomes fixed to the oscillator frequency divided by 2. This is compatible with the 80C32. The only exception is when timer 2 is used for baud-rate generation within power-management power-management mode. For PMM, the system clock (OSC/1024) is used as the input clock for timer 2. The timer 2 interrupt is automatically disabled when either RCLK or TCLK is set. Also, the TF2 (TCON.7) flag is not set on a timer rollover. rollover. The manual reload pin, T2EX (P1.1), does not cause a reload either. Table Table 12-6 illustrates this relationship.
Table 12-6. Timer 2 Baud-Rate Generation
111
SYSTEM CLOCK MODE
PMR REGISTER BITS 4X/ 2X 2X , CD1, CD0
TIMER 2 INPUT CLOCK FREQUENCY BAUD-RATE GENERATOR MODE (RCLK OR TCLK = 1)
Crystal multiply mode 4X Crystal multiply mode 2X Divide-by-1 (default) Power-management mode (/1024)
100 000 X01, X10 X11
OSC / 2 OSC / 2 OSC / 2 OSC / 1024
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Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide Serial Program Load Operation Program loading through a serial port is a convenient method of loading application software into the flash memory or external memory. Communication is performed over a standard, asynchronous serial communications port using a terminal emulator program with 8-N-1 (8 data bits, no parity, parity, 1 stop bit) protocol settings. A typical application would use a simple RS-232 serial interface to in-system program the device as part of a final production procedure. The hardware configuration for the serial program load operation is illustrated in Figure 15-2. A variety of cr ystals can be used to produce standard baud rates. The serial loader is designed to operate across a 3-wire interface from a standard UART. UART. The receive, transmit, and ground wires are all that are necessary to establish communication with the device. The serial loader implements an easy-to-use command line interface, which allows an Intel hex file to be loaded and read back from the device. Intel hex is the standard format output by 8051 cross-assemblers. TO PC TD ROOUT
RXDO
TOOUT DS232A TOIN
TXDO
ROIN RD
DTR R1IN
R1OUT
T1OUT
T1IN
DS89C420
VCC
RST
EA
PSEN
HC/AC125 Figure 15-2. Serial Load Hardware Configuration Configuration
AUTOBAUD-RATE DETECTION The serial bootstrap loader can automatically detect, within certain limits, the external baud rate and configure itself to that speed. The loader controls serial port 0 in mode 1 (asynchronous, 1 start bit, 8 data bits, no parity, 1 stop bit, full duplex), using timer 1 in 8-bit autoreload mode with the serial serial port 0 doubler bit (PCON.7) set. For these settings, an equation equation to calculate possible serial loader loader baud rates is provided as a function of crystal frequency and timer reload value. Table 15-1 shows baud rates generated using the equation:
Serial Loader_Baud rate =
Crystal Frequency 192 x ( 256-Timer Reload )
** Timer reload values values attempted by the loader: FF, FE, FD, FC, FB, FA, F8, F6, F5, F4, F3, F0, EC, EA, E8, E6, E0, DD, D8, D4, D0, CC, C0, BA, B0, A8, A0, 98, 80, 60, 40 When communicating with a PC COM port having a standard 8250/16450 UART, attempt to match the loader baud rate and PC COM port baud rate within 3% in order to maintain a reliable communication channel. If baud rates cannot be matched exactly, it is suggested configuring the loader to the faster baud rate to avoid the possibility of overflowing the DS89C420 serial input buffer.
129
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Ultra-High-Speed Flash Microcontroller User’s Guide
Ultra-High-Speed Flash Microcontroller User’s Guide USER CODE IN-APPLICATION IN-APPLICATION PROGRAMMING MODE The DS89C420 data sheet contains the most comprehensive information relating to the in-application programming mode. Additional supporting information can be found in the SFR definitions of FCNTL (D5h) and FDAT FDATA (F6h) of this user’s guide.
INTEL HEX FILE FILE FORMA FORMAT Assemblers that are 8051-compatible assemblers produce an absolute output file in Intel hex format. These files are composed of a series of records. Records in an Intel hex file have the following format:
The specific record elements are detailed as follows: : II aaaa tt dddddd ... dd xx where: :
Indicates a record beginning
II
Indicates the record length
aaaa
Indicates the 16-bit load address
tt
Indicates the record type
dd
Indicates hex data
xx
Indicates the checksum = (two’s (two’s complement (II+aa+a+tt+dd+dd+...dd) (II+aa+a+tt+dd+dd+...dd)
Record type 00 indicates a data record and type 01 indicates an end record. An end record appears as :00 00000 01 FF. These are the only valid record types for a NIL hex file. Spaces are provided for clarity. clarity. The following is a short Intel hex file. The data bytes begin at 01 and count up to 2F. Notice the record’s length, beginning address, and record type at the start of each line and the checksum at the end: :200000000102030405060708090A0B0C0D0E0F101112131415161718191A1B1C1D1E1F20D0 :0F0020002122232425262728292A2B2C2D2E2F79 :00000001FF
REVISION HISTORY January 24, 2001 Original Issue October 3, 2002 Revision 1
135
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TLC193 TLC193,, TLC393 TLC393 DUAL MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115E − DECEMBER 1986 − REVISED JULY 2003
TLC193 TLC193,, TLC393 TLC393 DUAL MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115E − DECEMBER 1986 − REVISED JULY 2003 D
Very ery Low Low Powe Powerr . . . 110 µW Typ at 5 V
D
Fast Fast Re Resp spon onse se Time Time . . . tPLH = 2.5 µs Typ With 5-mV Overdrive
D
Single Supply Operation: TLC3 TLC393 93C C . . . 3 V to to 16 16 V TLC3 TLC393 93II . . . 3 V to 16 V TLC3 TLC393 93Q Q . . . 4 V to to 16 16 V TLC3 TLC393 93M M . . . 4 V to to 16 V TLC1 TLC193 93M M . . . 4 V to to 16 V
D
D, JG, P, OR PW PACKAGE (TOP VIEW)
1OUT 1IN− 1IN+ GND
1
8
2
7
3
6
4
5
VDD 2OUT 2IN− 2IN+
FK PACKAGE (TOP VIEW)
On-Chip ESD Protection
T D U C O C D C N 1 N V N
description The TLC193 and TLC393 consist of dual independent micropower voltage comparators designed to operate from a single supply. They are functionally similar to the LM393 but uses one-twentieth the power for similar response times. The open-drain MOS output stage interfaces to a variety of loads and supplies. For a similar device with a push-pull output configuration (see the TLC3702 data sheet). Texas Instruments LinCMOS process offers superior analog performance to standard CMOS processes. Along with the standard CMOS advantages of low power without sacrificing speed, high input impedance, and low bias currents, the LinCMOS process offers extremely stable input offset voltages, even with differential input stresses of several volts. This characteristic makes it possible to build reliable CMOS comparators.
NC 1IN− NC 1IN+ NC
4
3
2
1 20 19 18
5
17
6
16
7
15
8
14 9 10 11 12 13
NC 2OUT NC 2IN− NC
C D C + C N N N N I N 2 G
NC − No internal connection
symbol (each comparator) IN + OUT IN −
The TLC393C is characterized for operation over the commercial temperature range of T A = 0°C to 70°C. The TLC393I is characterized for operation over the extended industrial temperature range of T A = −40°C to 85°C. The TLC393Q is i s characterized for operation over the full automotive temperature temperature range of T A = −40°C to 125°C. The TLC193M and TLC393M are characterized for operation over the full military temperature range of TA = −55°C to 125 °C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products products and disclaimers thereto appears at the end of this data sheet. LinCMOS is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners. PROD PRODUC UCTI TION ON DAT DATA info inform rmat atio ion n is curr curren entt as of publ public icat atio ion n date. date. Products Products conform conform to specificatio specifications ns per the terms of Texas Texas Instrument Instrumentss standard standard warranty warranty.. Productio Production n processing processing doesnot necessarily necessarilyinclude testing testing of all parameters. parameters.
Copyright 1986-2003, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TLC193 TLC193,, TLC393 TLC393 DUAL DUA L MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115D − DECEMBER 1986 − REVISED JULY 2003
1
TLC193 TLC193,, TLC393 TLC393 DUAL DUA L MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115D − DECEMBER 1986 − REVISED JULY 2003
AVAILABLE OPTIONS TA
VIOmax at 25°C
0°C to 70°C
PACKAGES SMALL OUTLINE (D)
CHIP CARRIER (FK)
CERAMIC DIP (JG)
PLASTIC DIP (P)
TSSOP (PW)
5 mV
TLC393CD
—
—
TLC393CP
TLC393CPWLE
− 40°C to 85°C
5 mV
TLC393ID
—
—
TLC393IP
TLC393IPWLE
− 40°C to 125°C
5 mV
TLC393QD
—
—
—
—
− 55°C to 125°C
5 mV
TLC393MD
TLC193MFK
TLC193MJG
TLC393MP
—
The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLC393CDR).
schematic OUT
OPEN-DRAIN CMOS OUTPUT
absolute maximum ratings over operating free-air temperature range (unless otherwise noted) † Supply voltage range, V DD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 18 V Differential input voltage, V ID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input voltage range, V I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to V DD Output voltage range, V O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 16 V Input current, I I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5 mA Output current, I O (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Total supply current into V DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA Total current out of GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating Operating free-air free-air temperatur temperature e range: range: TLC393C TLC393C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 °C to 70 °C TLC393I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85 °C TLC393Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 125 °C TLC393M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 55°C to 125 °C TLC193M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 55°C to 125 °C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150 °C Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260 °C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300 °C † Stresses beyond those listed under “absolute maximum ratings” ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” conditions ” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. reliability. NOTES: NOTES: 1. All voltage voltage values values,, except except differen differential tial voltage voltages, s, are with respec respectt to network network ground. ground. 2. Differentia Differentiall voltages voltages are at IN+ IN+ with respec respectt to IN− IN −. DISSIPATION RATING TABLE
2
PACKAGE
TA ≤ 25°C POWER RATING
DERATING FACTOR ABOVE TA = 25°C
TA = 70°C POWER RATING
TA = 85°C POWER RATING
TA = 125°C POWER RATING
D
725 mW
5.8 mW/°C
464 mW
377 mW
145 mW
FK
1375 mW
11.0 mW/°C
880 mW
715 mW
275 mW
JG
1050 mW
8.4 mW/°C
672 mW
546 mW
210 mW
P
1000 mW
8.0 mW/°C
640 mW
520 mW
—
PW
525 mW
4.2 mW/°C
336 mW
273 mW
—
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251− 77251−1443
TLC193 TLC193,, TLC393 TLC393 DUAL MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115E − DECEMBER 1986 − REVISED JULY 2003
TLC193 TLC193,, TLC393 TLC393 DUAL MICROP MICROPOWE OWER R LinCMO LinCMOS S VOLT VOLTAGE COMPARA COMPARATOR TOR SLCS115E − DECEMBER 1986 − REVISED JULY 2003
recommended operating conditions TLC393C Supply voltage, VDD Common-mode input voltage, VIC
M IN
NOM
3
5
−0.2
Low-level output current, IOL Operating free-air temperature, TA
UNIT
MAX 16
V
VDD − 1.5 20
V mA
70
°C
0
electrical characteristics at specified operating free-air temperature, V DD = 5 V (unless otherwise noted) PARAMETER
TEST CONDITIONS†
VIO
Input offset voltage
VIC = VICRmin, VDD = 5 V to 10 V, See Note 3
IIO
Input offset current
VIC = 2.5 V
IIB
Input bias current
VIC = 2.5 V
VICR
Common-mode input voltage range
CMMR
kSVR
Common-mode rejection ratio
Supply-voltage rejection ratio
TA
TLC393C MI N
25°C
TY P
MAX
1.4
5
0°C to 70°C
6 .5
25°C
1
70°C 5
70°C
VIC = VICRmin
VDD = 5 V to 10 V
VOL
Low-level output voltage
VID = −1 V, IOL = 6 mA
IOH
High-level output current
VID = 1 V,
IDD
Supp Supply pply cur curre rent nt (bo (both th com compa para p rato tors rs))
Outp Output puts s low low, No loa load d
VO = 5 V
0 to VDD − 1
0°C to 70°C
0 to VDD − 1.5 84
70°C
84
0°C
84
25°C
85
70°C
85
0°C
85
25°C
300
70°C
dB
dB 400 650
0.8
70°C 25°C
nA V
25°C
25°C
nA pA
0 .6
25°C
mV pA
0 .3
25°C
UNIT
22
0°C to 70°C
mV
40
nA
1
µA
40 50
µA
† All characteristics are measured with zero common-mode voltage unless otherwise noted. NOTE 3: The offset voltage limits given are the maximum values required to drive drive the output up to 4.5 4.5 V or down to 0.3 V. V.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251− 77251−1443
3
®
OPT101
MONOLITHIC PHOTODIODE AND SINGLE-SUPPLY TRANSIMPEDANCE AMPLIFIER DESCRIPTION
FEATURES
The OPT101 is a monolithic photodiode with on-chip transimpedance amplifier. Output voltage increases linearly with light intensity. The amplifier is designed for single or dual power supply operation, making it ideal for battery operated equipment.
q
SINGLE SUPPLY: +2.7 to +36V
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PHOTODIODE SIZE: 0.090 x 0.090 inch
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INTERNAL 1MΩ 1MΩ FEEDBACK RESISTOR
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HIGH RESPONSIVITY: 0.45A/W (650nm)
q
BANDWIDTH: 14kHz at RF = 1MΩ 1M Ω
q
LOW QUIESCENT CURRENT: 120 µA
q
AVAILABLE IN 8-PIN DIP, 5-PIN SIP, AND 8-LEAD SURFACE MOUNT PACKAGES
The integrated combination of photodiode and transimpedance amplifier on a single chip eliminates the problems commonly encountered in discrete designs such as leakage current errors, noise pick-up and gain peaking due to stray capacitance. The 0.09 x 0.09 inch photodiode is operated in the photoconductive mode for excellent linearity and low dark current.
APPLICATIONS q
MEDICAL INSTRUMENTATI INSTRUMENTATION ON
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LABORATORY INSTRUMENTATI INSTRUMENTATION ON
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POSITION AND PROXIMITY SENSORS
q
PHOTOGRAPHIC ANALYZERS
q
BARCODE SCANNERS
q
SMOKE DETECTORS
q
CURRENCY CHANGERS
The OPT101 operates from +2.7V to +36V supplies and quiescent current is only 120µA. It is available in clear plastic 8-pin DIP, 5-pin SIP and J-formed DIP for surface mounting. Temperature range is 0°C to 70 °C.
SPECTRAL RESPONSIVITY 0.7 (Pin available on DIP only.)
Ultraviolet
V+ 2
(2) 1 3pF 1MΩ
4 (4)
8pF
5 (5) 7.5mV
λ
0.6 ) W µ 0.5 / V ( t u 0.4 p t u O e 0.3 g a t l o 0.2 V
) 0.6 / W A ( y 0.5 t i v i s n o 0.4 p s e R 0.3 e d o i 0.2 d o t o h 0.1 P
Using Internal 1MΩ Resistor
0.1
0 200
OPT101
(SIP)
Infrared
0
VB
(1) 8
0.7
w e n o d l u e e e l r l e R B G Y
300
400
500 600 700 800 Wavelength (nm)
900
1000 1100
(3) 3 DIP
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXL ine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Im mediate Product Info: (800) 548-6132 ®
©
1994 Burr-Brown Corporation
SBBS002
SPECIFICATIONS
PDS-11257D
OPT101
Printed in U.S.A. March, 1998
SPECIFICATIONS At T A = +25°C, V S = +2.7V to +36V, λ = 650nm, internal 1M Ω feedback resistor, and R L = 10kΩ, unless otherwise noted. OPT101P, W PARAMETER
CONDITIONS
RESPONSIVITY Photodiode Current Voltage Output vs Temperature Unit to Unit Variation Nonlinearity (1) Photodiode Area DARK ERRORS, RTO(2) Offset Voltage, Output vs Temperature vs Power Supply Voltage Noise, Dark, f B = 0.1Hz to 20kHz
MIN
650nm 650nm 650nm FS Output = 24V (0.090 x 0.090in) (2.29 x 2.29mm) +5 VS = +2.7V to +36V V S = +15V, VPIN3 = –15V
POWER SUPPLY Operating Voltage Range Quiescent Current
+7.5 ± 2.5 10 300 1 ± 0.5 ± 0.5 ±50
VOUT = 10Vp-p V OUT = 10V Step V OUT = 10V Step
100%, Return to Linear Operation
OUTPUT Voltage Output, High Capacitive Load, Stable Operation Short-Circuit Current
MAX
0.45 0.45 100 ±5 ±0.01 0.008 5.2
TRANSIMPEDANCE GAIN Resistor Tolerance, P W vs Temperature FREQUENCY RESPONSE Bandwidth Rise Fall Time, 10% to 90% Settling Time, 0.05% 0.1% 1% Overload Recovery
TYP
(V S) – 1.3 V S = 36V
+10 100
±2
MΩ % % ppm/°C
(V S) – 1.15 10 15
V nF mA
0 0 –25
+36 240
V µA µA
+70 +70 +85
°C °C °C °C/W
MAX
UNITS
100
mV µV/ °C µV/V µVrms
kHz µs µs µs µs µs
120 220
TEMPERATURE RANGE Specification Operating Storage Thermal Resistance, θ JA
A /W V/ µW ppm/ °C % % of FS in 2 mm 2
14 28 160 80 70 50
+2.7 Dark, V PIN3 = 0V RL = ∞, V OUT = 10V
UNITS
NOTES: (1) Deviation in percent of full scale from best-fit straight line. (2) Referred to Output. Includes all error sources.
PHOTODIODE SPECIFICATIONS TA = +25°C, VS = +2.7V to +36V unless otherwise noted. Photodiode of OPT101P PARAMETER
CONDITIONS
Photodiode Area Current Responsivity Dark Current vs Temperature Capacitance
MIN
(0.090 x 0.090in) (2.29 x 2.29mm) 650nm 650nm V DIODE = 7.5mV
TYP 0.008 5.2 0.45 865 2.5 doubles every 7 °C 1200
in 2 mm 2 A /W µA/W/cm2 pA pF
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent ri ghts or licenses to any of the circuits descri bed herein are implied or granted to any third party. BURR- BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
OPT101
OP AMP SPECIFICATIONS
2
OP AMP SPECIFICATIONS At TA = +25°C, V S = +2.7V to +36V, λ = 650nm, internal 1M Ω feedback resistor, and R L = 10k Ω, unless otherwise noted. OPT101 Op Amp(1) PARAMETER
CONDITIONS
INPUT Offset Voltage vs Temperature vs Power Supply Input Bias Current vs Temperature Input Impedance Differential Common-Mode Common-Mode Input Voltage Range Common-Mode Rejection
MIN
TYP
MAX
±0.5 ±2.5 10 165 1
(–) Input (–) Input
UNITS mV µV/ °C µV/V pA pA/ °C
400 || 5 250 || 35 0 to [(V S) – 1] 90
M Ω || pF G Ω || pF V dB
OPEN-LOOP GAIN Open-loop Voltage Gain
90
dB
FREQUENCY RESPONSE Gain-Bandwidth Product (2) Slew Rate Settling Time 1% 0.1% 0.05%
2 1 5.8 7.7 8.0
MHz V/µs µs µs µs
OUTPUT Voltage Output, High Short-Circuit Current POWER SUPPLY Operating Voltage Range Quiescent Current
Linear Operation
(V S–) 1.3
(V
V S = +36V
S)
– 1.15 15
+2.7 Dark, V PIN3 = 0V RL ∞, VOUT = 10V
120 220
V mA +36 240
V µA µA
NOTES: (1) Op amp specifications provided for information and comparison only. (2) Stable gains ≥ 10V/V.
®
3
OPT101
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package 3-State Bus-Driving Outputs Full Parallel Access for Loading Buffered Control Inputs
SN54LS373, SN54LS374, SN54S373, SN54S374 . . . J OR W PACKAGE SN74LS373, SN74S374 . . . DW, N, OR NS PACKAGE SN74LS374 . . . DB, DW, N, OR NS PACKAGE SN74S373 . . . DW OR N PACKAGE (TOP VIEW)
OC 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND
Clock-Enable Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374) P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)
description These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q C†
† C for ’LS373 and ’S373; CLK for ’LS374 and ’S374. SN54LS373, SN54LS374, SN54S373, SN54S374 . . . FK PACKAGE (TOP VIEW) C
D Q C C Q 1 1 O V 8
The eight latches of the ’LS373 and ’S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is i s taken low, the output is latched at the level of the data that was set up. The eight flip-flops of the ’LS374 and ’S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.
1
2D 2Q 3Q 3D 4D
4
3
2
1 20 19 18
5
17
6
16
7
15
8
14 9 10 11 12 13
8D 7D 7Q 6Q 6D
† Q D Q D 4 N C 5 5 G
† C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in ei ther a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. OC does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. parameters.
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
1
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted) † (’LS devices) Supply voltage, V CC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, V I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Off-state output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Package thermal impedance, θJA (see Note 2): DB package package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 °C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150 °C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: NOTES: 1. Voltage Voltage values values a are re with respect respect to to network network ground ground te termina rminal. l. 2. The package package thermal thermal impedance impedance is calculated calculated in accordance accordance with JESD JESD 51-7.
recommended operating conditions SN54LS’
SN74LS’
MI N
NOM
MAX
MI N
NOM
MAX
4.5
5
5
4 .7 5
5
5.25
V
VCC
Supply voltage
VOH
High-level output voltage
5 .5
5 .5
V
IOH
High-level output current
–1
–2.6
mA
IOL
Low-level output current
12
24
mA
w
u se ur ura on
su
p me a a se up
h
aa o
me
CLK high
15
15
CLK low
15
15
’LS373
5↓
5↓
’LS374
20↑
20↑
’LS373 ’LS374‡
20↓
20↓
5↑
0↑
ns ns ns
TA Operating free-air temperature – 55 125 0 70 °C ‡ The t specification applies only for data frequency below 10 MHz. Designs above 10 MHz should use a minimum of 5 ns (commercial only). h
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
SN54LS373, SN54LS374, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54LS’ MIN TYP‡ MAX
TEST CONDITIONS VIH VIL
High-level input voltage Low-level input voltage
VIK
Input clamp voltage
2 VCC = MIN,
II = –18 mA
OH
g - e ve ve o u p pu u vo age
VCC = MIN, VIL = VIL max,
VIH = 2 V, IOH = MAX
OL
ow- eve ou pu vo age
VCC = MIN, VIL = VIL max
VIH = 2 V,
VCC = MAX, VO = 2.7 V
VIH = 2 V,
VCC = MAX, VO = 0.4 V
VIH = 2 V,
Off-state output current, OZH high-level vo volt ag age ap applied OZL
Off-state output current, low-level voltage applied
I
Input current at maximum input voltage
,
IIH IIL
Low-level input current
VCC = MAX, VCC = MAX,
IOS
Short-circuit output current§
VCC = MAX
CC
High-level input current
CC =
0 .7
0 .8
V
–1 .5
– 1 .5
V
. 0 .2 5
V
.
.
0 .4
0 .2 5
0 .4
0 .3 5
0 .5
–
I= VI = 2.7 V VI = 0.4 V –30
VCC = MAX, Output control at 4.5 V
upp pp y curren curren
2
. IOL = 12 mA IOL = 24 mA
SN74LS’ MIN TYP‡ MAX
– .
.
20
20
A
– 0 .4
–0 .4
mA
–130
mA
–130
–30
’LS373
24
40
24
40
’LS374
27
40
27
40
m
m
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. ‡ All typical values are at V CC = 5 V, TA = 25°C. § Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second.
switching characteristics, V CC = 5 V, TA = 25°C (see Figure 1) FROM (INPUT)
tPHL tPLH tPHL tPZH tPZL PHZ PLZ
MI N
TY P
’LS374 MAX
RL = 667 Ω CL = 45 pF, See Note 3
fmax tPLH
’LS373
TO (OUTPUT)
aa or
OC
MI N
TY P
35
50
MAX MHz
ny
RL = 667 Ω CL = 45 pF, See Note 3
12
18
12
18
ny
RL = 667 Ω CL = 45 pF, See Note 3
20
30
15
28
18
30
19
28
ny
RL = 667 Ω CL = 45 pF, See Note 3
15
28
20
26
25
36
21
28
ny
L=
L=
p
ns ns ns
ns
NOTE 3: Maximum Maximum clock frequen frequency cy is tested tested with all outputs outputs loaded. loaded. fmax = maximum clock frequency tPLH = propagation delay time, low-to-high-level output tPHL = propagation delay time, high-to-low-level output tPZH = output enable time to high level tPZL = output enable time to low level tPHZ = output disable time from high level tPLZ = output disable time from low level
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
December 1999
LMD18200 3A, 55V H-Bridge General Description
n
The LMD18200 is a 3A H-Bridge designed for motion motion control applications. The device is built using a multi-technology process which comb combines ines bipolar and CMO CMOS S cont control rol circuitry with DMOS power devices on the same monolithic structure. Ideal for driving DC and stepper motors; the LMD18200 accommodates peak output currents up to 6A. An innovative circuit which facilitates low-loss sensing of the output current has been implemented.
n n n
n n n n
n
n
Delivers up to 3A continuous output Operates at supply voltages up to 55V Low RDS(ON) typically 0.3Ω per switch TTL and CMOS compatible inputs
No “shoot-through” current Thermal warning flag output at 145˚C Thermal shutdown (outputs off) at 170˚C Internal clamp diodes Shorted load protection Internal charge pump with external bootstrap capability
Applications n
Features n
n
n n
DC and stepper motor drives Position and velocity servomechanisms Factory automation robots Numerically controlled machinery Computer printers and plotters
L M D 1 8 2 0 0 3 A , 5 5 V H - B r i d g e
Functional Diagram
DS010568-1
FIGURE 1. Functional Block Diagram of LMD18200
© 1999 National Semiconductor Corporation
DS010568
www.national.com
Absolute Maximum Ratings
Power Dissipation (T A = 25˚C, Free Air) Junction Temperature, Temperature, TJ(max) ESD Susceptibility (Note 4) Storage Temperature, Temperature, TSTG Lead Le ad Tempe pera rattur ure e (S (Sol olde deri ring ng,, 10 se sec c.)
(Note 1)
If Militar Military/Aero y/Aerospac space e spec specified ified devic devices es are requi required, red, please pleas e cont contact act the Nation National al Semic Semicondu onductor ctor Sales Office Office// Distributors for availability and specifications.
Total Supply Voltage (V S, Pin 6) Voltage at Pins 3, 4, 5, 8 and 9 Voltage at Bootstrap Pins (Pins 1 and 11) Peak Output Current (200 ms) Continuous Output Current (Note 2) Power Dissipation (Note 3)
60V 12V
3W 150˚C 1500V −40˚C to +150˚C 300 00˚C ˚C
Operating Ratings(Note 1)
VOUT +16V 6A 3A 25W
Junction Temperature, TJ VS Supply Voltage
−40˚C to +125˚C +12V to +55V
Electrical Characteristics (Note 5) The following specifications apply for V S = 42V, unless otherwise specified. Boldface limits apply over the entire operating temperature range, −40˚C ≤ TJ ≤ +125˚C, all other limits are for T A = TJ = 25˚C. RDS(ON)
Symbol
Switch ON Resistance
RDS(ON)
Switch ON Resistance
VCLAMP
Cla lam mp Dio iode de For orw war ard d Dr Dro op
Conditions Output Current = 3A (Note 6) Output Current = 6A (Note 6) Clam amp p Curr rre ent = 3A (Note 6)
VIL
Logic Low Input Voltage
Pins 3, 4, 5
0.8
V (max)
IIL
Logic Low Input Current
VIN = −0.1V, Pins = 3, 4, 5
−10
µA (max)
VIH
Logic High Input Voltage
Pins 3, 4, 5
2
V (min)
IIH
Logic High Input Current Current Sense Output
VIN = 12V, Pins = 3, 4, 5 IOUT = 1A (Note 8)
377
Current Sense Linearity
1A ≤ IOUT ≤ 3A (Note 7)
±6
Undervoltage Lockout
Outputs turn OFF
TJW
Warning Flag Temperature
VF(ON)
Flag Output Saturation Voltage
0.15
IF(OFF)
Flag Output Leakage
Pin 9 ≤ 0.8V, IL = 2 mA TJ = TJW, IL = 2 mA VF = 12V
TJSD
Shutdown Temperature
Outputs Turn OFF
170
IS
Quiescent Supply Current
All Logic Inputs Low
13
tDon
Outp Ou tput ut Tu Turn rn-O -On n De Dela lay y Ti Time me
Sour So urci cing ng Ou Outp tput uts, s, I OUT = 3A Sinking Outputs, I OUT = 3A
300
ns
300
ns
ton
tDoff toff
Parameter
Output Out put Tur Turn-O n-On n Sw Switc itchin hing g Tim Time e
Bootst Boo tstrap rap Cap Capaci acitor tor = 10 nF Sourcing Outputs, I OUT = 3A
Typ
Limit
U nits
0.33
0.4/0.6
Ω (max)
0.33
0.4/0.6
Ω (max)
1.5
V (max)
−0.1
V (min)
1.2
12
V (max)
10
µA (max)
325/300
µA (min)
450 425/ 450
µA (max)
±9
%
9
V (min)
11
V (max)
145 0.2
˚C V 10
µA (max) ˚C
25
mA (max)
100
ns
80
ns
Outp Ou tput ut Tu Turn rn-O -Off ff De Dela lay y Ti Time mes s
Sinking Outputs, I OUT = 3A Sour So urci cing ng Ou Outp tput uts, s, I OUT = 3A
200
ns
200
ns
Output Out put Tur Turn-O n-Off ff Sw Switc itchin hing g Tim Times es
Sinking Outputs, I OUT = 3A Bootst Boo tstrap rap Cap Capaci acitor tor = 10 nF Sourcing Outputs, I OUT = 3A Sinking Outputs, I OUT = 3A
75
ns
70
ns
tpw
Minimum Input Pulse Width
Pins 3, 4 and 5
1
µs
tcpr
Charge Pump Rise Time
No Bootstrap Capacitor
20
µs
3
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L M D 1 8 2 0 0
0 0 2 8 1 D M L
Pinout Description (See Connection Diagram) Diagram) (Continued) Pin 6, VS Power Supply Pin 7, GROUND Connection: This pin is the ground return, and is internally connected to the mounting tab. Pin 8, CURREN CURRENT T SENSE Output: This pin provi provides des the sourcing sourc ing curren currentt sensi sensing ng outp output ut sign signal, al, whic which h is typi typicall cally y 377 µA/A. Pin 9, THERMAL FLAG Output: This pin provides the thermal warning flag output signal. Pin 9 becomes active-low at 145˚C (junction temperature). However the chip will not shut itself down until 170˚C is reached at the junction.
DS010568-4
FIGURE 2. Locked Anti-Phase PWM Control
Pin 10, OUTPUT 2: Half H-bridge number 2 output.
Sign/magnitude PWM consists of separate direction (sign) and amplitude (magnitude) signals (see Figure 3 ). ). The (absolute) magnitude signal is duty-cycle modulated, and the absence of a pulse signal (a continuous logic low level) represents zero drive. Current delivered to the load is proportional to pulse width. For the LMD18200, the DIRECTION input (pin 3) is driven by the sign signal and the PWM input (pin 5) is driven by the magnitude signal.
Pin 11, BOOTSTRAP 2 Input: Bootstrap capacitor pin for Halff H-b Hal H-brid ridge ge num number ber 2. The rec recomm ommend ended ed cap capaci acitor tor (10 nF) is connected between pins 10 and 11. TABLE 1. Logic Truth Table PWM
Dir
B ra rake
H
H
L
Source 1, Sink 2
Active Output Dri ve vers
H
L
L
Sink 1, Source 2
L
X
L
Source 1, Source 2
H
H
H
Source 1, Source 2
H
L
H
Sink 1, Sink 2
L
X
H
NONE
Application Information TYPES OF PWM SIGNALS
The LMD1 LMD18200 8200 readily interfaces interfaces with different different form forms s of PWM signals. Use of the part with two of the more popular forms of PWM is described in the following paragraphs.
DS010568-5
FIGURE 3. Sign/Magnitude PWM Control
Simple, locked anti-phase PWM consists of a single, variable duty-cycle signal in which is encoded both direction and amplitude information (see Fig ) . A 50% 50% duty-cycle Figure ure 2 ). PWM signal represents represents zero drive, since the net value of voltage (integrated over one period) delivered to the load is zero. For the LMD18200, the PWM signal drives the direction input (pin 3) and the PWM input (pin 5) is tied to logic high.
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SIGNAL TRANSITION REQUIREMENTS
To ensure proper internal logic performance, it is good practice to avoid aligning the falling and rising edges of input signals. A delay of at least 1 µsec should be incorporated between transitions of the Direction, Brake, and/or PWM input signals. A conservative approach is be sure there is at least 500ns delay between the end of the first transition and the beginning of the second transition. See Figure 4 .
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Continental Device India Limited An ISO/TS16949 and ISO 9001 Certified Company
NPN SILICON PLANAR SWITCHING TRANSISTORS
2N2221A 2N2222A TO-18
Switching And Linear Application DC And VHF Amplifier Applications Applications ABSOLUTE MAXIMUM RATINGS DESCRIPTION
SYMBOL
2N2221A,22A
UNIT
Collector -Emitter Voltage VCEO 40 VCBO 75 Collector -Base Voltage V E BO 6.0 Emitter -Base Voltage IC 800 Collector Current Continuous PD 500 Power Dissipation @Ta=25 degC Derate Above 25deg C 2.28 PD 1.2 @ Tc=25 degC Derate Above 25deg C 6.85 Tj, Tstg -65 to +200 Operating And Storage Junction Temperature Range ELECTRICAL CHARACTERISTICS (Ta=25 deg C Unless Otherwise Specified) DESCRIPTION
SYMBOL TEST CONDITION
Collector -Emitter Voltage Collector -Base Voltage Emitter-Base Voltage Collector-Cut off Current
VCEO VCBO V E BO ICBO
Emitter-Cut off Current Base-Cut off Current Collector Emitter Saturation Voltage
Ta=150 deg C VCB=60V, IE=0 ICEX VCE=60V, VEB=3V I E BO VEB=3V, IC=0 I BL VCE=60V, VEB=3V VCE(Sat)* IC I C=150mA,IB=15mA IC=500mA,IB=50mA VBE(Sat) * IC IC=150mA,IB=15mA IC=500mA,IB=50mA
Base Emitter Saturation Voltage
Continental Device India Limited
IC=10mA,IB=0 IC=10uA.IE=0 IE=10uA, IC=0 VCB=60V, IE=0
Data Sheet
V V V mA mW mW/deg C W mW/deg C deg C
VALUE M IN MAX 40 75 6.0 10
-
10 10 10 20 0.3 1.0 0.6-1.2 2.0
UNIT V V V nA
uA nA nA nA V V V V
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